JPS63124753U - - Google Patents
Info
- Publication number
- JPS63124753U JPS63124753U JP1547687U JP1547687U JPS63124753U JP S63124753 U JPS63124753 U JP S63124753U JP 1547687 U JP1547687 U JP 1547687U JP 1547687 U JP1547687 U JP 1547687U JP S63124753 U JPS63124753 U JP S63124753U
- Authority
- JP
- Japan
- Prior art keywords
- stem
- metal plate
- hermetically sealed
- sealed package
- electrode pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1547687U JPS63124753U (xx) | 1987-02-06 | 1987-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1547687U JPS63124753U (xx) | 1987-02-06 | 1987-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63124753U true JPS63124753U (xx) | 1988-08-15 |
Family
ID=30806446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1547687U Pending JPS63124753U (xx) | 1987-02-06 | 1987-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63124753U (xx) |
-
1987
- 1987-02-06 JP JP1547687U patent/JPS63124753U/ja active Pending