Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filedfiledCritical
Priority to JP1574787UpriorityCriticalpatent/JPS63124751U/ja
Publication of JPS63124751UpublicationCriticalpatent/JPS63124751U/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
H01L2924/151—Die mounting substrate
H01L2924/153—Connection portion
H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
