JPS63124750U - - Google Patents
Info
- Publication number
- JPS63124750U JPS63124750U JP1987015522U JP1552287U JPS63124750U JP S63124750 U JPS63124750 U JP S63124750U JP 1987015522 U JP1987015522 U JP 1987015522U JP 1552287 U JP1552287 U JP 1552287U JP S63124750 U JPS63124750 U JP S63124750U
- Authority
- JP
- Japan
- Prior art keywords
- conductive material
- thermally conductive
- case
- semiconductor chip
- power semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案の実施例の電力ＩＣの蓋を取
り外した斜視図、第２Ａ図、第２Ｂ図、及び第２
Ｃ図は、それぞれ従来の電力ＩＣの外形を示す斜
視図、内部をしめす斜視図、及びケースの斜視図
である。
図において、１…蓋、２…ケース、２ａ…底部
、２ｂ…側壁、３…端子台組立、４…端子ピン、
５…電力半導体チツプ。
FIG. 1 is a perspective view with the lid removed of a power IC according to an embodiment of the present invention, FIG. 2A, FIG. 2B, and FIG.
Figure C is a perspective view showing the outer shape of a conventional power IC, a perspective view showing the inside, and a perspective view of the case, respectively. In the figure, 1...lid, 2...case, 2a...bottom, 2b...side wall, 3...terminal block assembly, 4...terminal pin,
5...Power semiconductor chip.
Claims (1)
が開口し、側壁の少なくとも１つがピン端子を底
部に平行に取り付けた端子台組立からなり、少な
くとも上記底部が熱伝導性材料で作られたケース
と、 上記ケースの上部の開口を閉じる熱伝導性材料
の蓋とからなる電力ＩＣ。[Claims for Utility Model Registration] A terminal block assembly is provided with a power semiconductor chip attached to the bottom, the top is open, and at least one of the side walls has a pin terminal attached parallel to the bottom, and at least the bottom is made of a thermally conductive material. and a lid made of a thermally conductive material that closes an opening at the top of the case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987015522U JPS63124750U (en) | 1987-02-06 | 1987-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987015522U JPS63124750U (en) | 1987-02-06 | 1987-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63124750U true JPS63124750U (en) | 1988-08-15 |
Family
ID=30806534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987015522U Pending JPS63124750U (en) | 1987-02-06 | 1987-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63124750U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4310512Y1 (en) * | 1965-09-22 | 1968-05-08 | ||
| JPS5892241A (en) * | 1981-11-28 | 1983-06-01 | Mitsubishi Electric Corp | Package for semiconductor device |
-
1987
- 1987-02-06 JP JP1987015522U patent/JPS63124750U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4310512Y1 (en) * | 1965-09-22 | 1968-05-08 | ||
| JPS5892241A (en) * | 1981-11-28 | 1983-06-01 | Mitsubishi Electric Corp | Package for semiconductor device |