JPS63124750U - - Google Patents
Info
- Publication number
- JPS63124750U JPS63124750U JP1987015522U JP1552287U JPS63124750U JP S63124750 U JPS63124750 U JP S63124750U JP 1987015522 U JP1987015522 U JP 1987015522U JP 1552287 U JP1552287 U JP 1552287U JP S63124750 U JPS63124750 U JP S63124750U
- Authority
- JP
- Japan
- Prior art keywords
- conductive material
- thermally conductive
- case
- semiconductor chip
- power semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987015522U JPS63124750U (US20090163788A1-20090625-C00002.png) | 1987-02-06 | 1987-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987015522U JPS63124750U (US20090163788A1-20090625-C00002.png) | 1987-02-06 | 1987-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63124750U true JPS63124750U (US20090163788A1-20090625-C00002.png) | 1988-08-15 |
Family
ID=30806534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987015522U Pending JPS63124750U (US20090163788A1-20090625-C00002.png) | 1987-02-06 | 1987-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63124750U (US20090163788A1-20090625-C00002.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4310512Y1 (US20090163788A1-20090625-C00002.png) * | 1965-09-22 | 1968-05-08 | ||
| JPS5892241A (ja) * | 1981-11-28 | 1983-06-01 | Mitsubishi Electric Corp | 半導体装置用容器 |
-
1987
- 1987-02-06 JP JP1987015522U patent/JPS63124750U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4310512Y1 (US20090163788A1-20090625-C00002.png) * | 1965-09-22 | 1968-05-08 | ||
| JPS5892241A (ja) * | 1981-11-28 | 1983-06-01 | Mitsubishi Electric Corp | 半導体装置用容器 |
