JPS63122224U - - Google Patents
Info
- Publication number
- JPS63122224U JPS63122224U JP1359387U JP1359387U JPS63122224U JP S63122224 U JPS63122224 U JP S63122224U JP 1359387 U JP1359387 U JP 1359387U JP 1359387 U JP1359387 U JP 1359387U JP S63122224 U JPS63122224 U JP S63122224U
- Authority
- JP
- Japan
- Prior art keywords
- mounting board
- lead wire
- mounting
- instrument
- instruments
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 239000013013 elastic material Substances 0.000 claims 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Description
第１図〜第３図は本考案の第１実施例であり、
第１図は全体斜視図、第２図および第３図は要部
の拡大断面図、第４図Ａ，Ｂ，Ｃは第２実施例を
示す断面図、第５図は第３実施例を示す断面図、
第６図は第４実施例を示す断面図、第７図は第５
実施例を示す斜視図である。
１……取付盤、２……カバー、７ａ，１２ａ，
１３ａ……壁面、５，１１……計器類、１３……
受部、１４，１４ａ，１４ｂ，１４ｃ……取付部
、１５……クランプ部材、１８……リード線挿通
部、１９，１９ａ，１９ｂ……リード線。
Figures 1 to 3 show the first embodiment of the present invention,
Fig. 1 is an overall perspective view, Figs. 2 and 3 are enlarged sectional views of main parts, Fig. 4 A, B, and C are sectional views showing the second embodiment, and Fig. 5 is a sectional view of the third embodiment. A cross-sectional view showing,
FIG. 6 is a sectional view showing the fourth embodiment, and FIG. 7 is a sectional view showing the fifth embodiment.
It is a perspective view showing an example. 1...Mounting board, 2...Cover, 7a, 12a,
13a... Wall surface, 5, 11... Instruments, 13...
Receiving part, 14, 14a, 14b, 14c... Attachment part, 15... Clamp member, 18... Lead wire insertion part, 19, 19a, 19b... Lead wire.
Claims (1)
面または前記取付盤の裏面側に設けた受部から離
間させて前記取付盤の裏面側にその取付盤と一体
に形成された取付部と、この取付部に前記計器類
の壁面または取付盤に設けられた受部に当接また
は近接するようにして装着され、前記取付盤の裏
面との間に所定の間隔を有してリード線挿通部を
形成する弾性材料からなるクランプ部材とを具備
することを特徴とするリード線保持装置。 Instruments provided on a mounting board; and a mounting part formed integrally with the mounting board on the back side of the mounting board spaced apart from a wall surface of the instruments or a receiving part provided on the back side of the mounting board. , the instrument is attached to the mounting part so as to be in contact with or in close proximity to the wall surface of the instrument or the receiving part provided on the mounting board, and the lead wire is inserted with a predetermined distance between it and the back surface of the mounting board. 1. A lead wire holding device comprising: a clamp member made of an elastic material forming a portion of the lead wire holding device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1359387U JPS63122224U (en) | 1987-01-30 | 1987-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1359387U JPS63122224U (en) | 1987-01-30 | 1987-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63122224U true JPS63122224U (en) | 1988-08-09 |
Family
ID=30802797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1359387U Pending JPS63122224U (en) | 1987-01-30 | 1987-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63122224U (en) |
-
1987
- 1987-01-30 JP JP1359387U patent/JPS63122224U/ja active Pending
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