JPS63122198A - Electronic equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] Technical fields> The present invention relates to printed circuit boards and flexible circuit boards.

This invention relates to an electronic device in which a circuit sheet or the like is eliminated and these electronic circuits are simultaneously molded onto the cabinet or chassis when the cabinet or chassis is molded.

<Prior art> A conventional electronic device is an electronic desktop calculator (hereinafter referred to as
The calculator has a structure in which a calculator operating move unit is incorporated between an upper cabinet 15 and a lower cabinet 16, such as a calculator. The calculator operation move unit includes a printed circuit board 17. LSI chip 18 soldered onto the printed circuit board 17. It consists of a liquid crystal cell 21 connected to the circuit pattern 20 of the printed circuit board 17 via a conductive anisotropic pressure bonding rubber 19, and a solar cell 22 connected to the circuit pattern 20 by lead wiring. Note that 23 is a key top, and as shown in FIG. 5, the key top 23 is provided with a key contact 24 on the circuit pattern 20 side. In FIG. 5, 25 indicates the lead wiring.

<Objective of the Invention> The present invention provides an electronic device in which an electronic circuit is simultaneously molded on a cabinet or chassis, which simplifies the structure, and
We provide electronic equipment designed to reduce costs.

<Example> The present invention will be explained in detail below.

FIG. 1 is a structural diagram of a calculator according to an embodiment of the present invention.

In the figure, l represents the upper cabinet 2 of the equipment and the lower cabinet of the equipment.

The upper cabinet 1 is provided with a key top 3. The lower cabinet 2 has a key terminal 4 corresponding to the key top 3. Solar cell crimp terminal 5. A conductive (circuit) pattern 8 including a liquid crystal crimp terminal 6 and an LSI crimp terminal 7 is formed. The conductive pattern 8 is an upper pattern 8 formed on one surface of the lower cabinet 2 (the surface facing the upper cabinet 1).
It consists of a lower pattern 8b formed on the other side of the lower cabinet 2, and a connecting portion 8c connecting the upper pattern 8a and the lower pattern 8b.

The connecting portion 8c is provided in a through hole bored in the lower cabinet 2.

The conductive pattern 8 is formed at the same time as the lower cabinet 2 is molded using composite (multicolor) plastic molding. Insert molding can also be used as a molding method.

In addition, in the figure, 9 represents a back plate label.

FIG. 2 shows the structure of the conductive pattern 8 formed on the lower cabinet 1. As shown in the figure, double-sided patterns 8a and 8b are formed to improve the pattern density.

Then, as shown in FIG. 3, the liquid crystal cell II forming the LSIS border 2110 display part and the solar cell 12 are placed on the lower cabinet 2 on which the conductive pattern 8 has been simultaneously formed,
Each pin terminal of the LSI chip 0 is electrically connected to the LSI crimp terminal 7, the lead electrode of the liquid crystal cell 11 is electrically connected to the liquid crystal crimp terminal 6, and the solar cell 12 is electrically connected to the lead electrode of the liquid crystal cell 11. The connecting terminal is electrically connected to the solar cell crimp terminal 5. Subsequently, the key rubber 13 is inserted into the gap between the lower cabinet 2 and the upper cabinet 1, and the LSI chip 10. Liquid crystal cell 11 and solar cell 12 in both cabinets! Clamp and crimp with 2 and 2. The key rubber + 3 has a conductive part 14 corresponding to each key terminal 4, and when the operator operates the key top 3, the predetermined conductive part 14 makes one of the key terminals 4 conductive. Accordingly, the key signal is transmitted to the LSI chip 1.
It is input to 0. The LSI chip 10 executes calculations in response to the key signal, and outputs the calculation results for display on the liquid crystal cell 11.

As described above, by exposing the conductive pattern 8 to the back surface of the lower cabinet 2 through the through-hole,
The exposed portion can be used as a connector with the outside.

In the above embodiment, a structure has been described in which the conductive pattern 8 is simultaneously molded on the lower cabinet 2 when the lower cabinet 2 is molded, but it is also possible to change this to one in which the conductive pattern is simultaneously molded when the chassis is molded. Furthermore, the conductive pattern 8 is not limited to the electronic circuit of the embodiment.

<Effects> As described above, since the electronic device according to the present invention is equipped with an electronic circuit that is simultaneously molded on the cabinet or chassis at the time of molding the cabinet or chassis, it is possible to connect a printed circuit board, a flexible circuit board, a sheet circuit, or a liquid crystal cell. This eliminates the need for anisotropic rubber, etc., resulting in reductions in material costs, labor costs, and costs.

[Brief explanation of the drawing]

FIG. 1 is a structural diagram of an electronic device according to an embodiment of the present invention, and FIG.
The figure is a structural diagram of a conductive pattern formed on the lower cabinet of the electronic device, FIG. 3 is a side view of the electronic device, and FIG.
The figure is a structural diagram of a conventional electronic device, and FIG. 5 is a side view of the conventional electronic device. 1... Upper cabinet, 2... Lower cabinet, 8
... Conductive pattern, 10... LSI chip, 11.
...Liquid crystal cell, 12...Solar cell.

Claims (1)

[Claims] 1. An electronic device characterized by comprising an electronic circuit that is simultaneously molded on the cabinet or chassis when the cabinet or chassis is molded.