JPS63120713A - Resin composition for electrical laminate - Google Patents
Resin composition for electrical laminateInfo
- Publication number
- JPS63120713A JPS63120713A JP26612986A JP26612986A JPS63120713A JP S63120713 A JPS63120713 A JP S63120713A JP 26612986 A JP26612986 A JP 26612986A JP 26612986 A JP26612986 A JP 26612986A JP S63120713 A JPS63120713 A JP S63120713A
- Authority
- JP
- Japan
- Prior art keywords
- monomer
- resin composition
- main chain
- meth
- vinyl monomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 9
- 239000000178 monomer Substances 0.000 claims abstract description 26
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 14
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 14
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims abstract description 11
- 229920000642 polymer Polymers 0.000 claims abstract description 11
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 6
- 238000004132 cross linking Methods 0.000 claims abstract description 5
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 3
- 239000001301 oxygen Substances 0.000 claims abstract description 3
- 229920005604 random copolymer Polymers 0.000 claims abstract description 3
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- -1 methacryloyl Chemical group 0.000 claims description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 10
- 239000012948 isocyanate Substances 0.000 abstract description 8
- 150000002513 isocyanates Chemical class 0.000 abstract description 8
- 239000000203 mixture Substances 0.000 abstract description 6
- 150000002430 hydrocarbons Chemical group 0.000 abstract description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 abstract description 2
- 238000004080 punching Methods 0.000 abstract description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 239000002904 solvent Substances 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 241000287828 Gallus gallus Species 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- ACIAHEMYLLBZOI-ZZXKWVIFSA-N Unsaturated alcohol Chemical compound CC\C(CO)=C/C ACIAHEMYLLBZOI-ZZXKWVIFSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- MBHRHUJRKGNOKX-UHFFFAOYSA-N [(4,6-diamino-1,3,5-triazin-2-yl)amino]methanol Chemical compound NC1=NC(N)=NC(NCO)=N1 MBHRHUJRKGNOKX-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 1
- INLLPKCGLOXCIV-UHFFFAOYSA-N bromoethene Chemical compound BrC=C INLLPKCGLOXCIV-UHFFFAOYSA-N 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- LKFAPHHHWRMPGC-UHFFFAOYSA-N butan-1-ol prop-2-enoic acid Chemical compound CCCCO.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C LKFAPHHHWRMPGC-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000004508 fractional distillation Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 239000005267 main chain polymer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、電気機器、電子機器、通信機等に使用される
金属箔張り積層板用樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a resin composition for metal foil-clad laminates used in electrical equipment, electronic equipment, communication equipment, and the like.
[従来の技術]
金属箔張り電気用積層板に用いられる樹脂としては従来
フェノール樹脂、エポキシ樹脂、不飽和ポリエステル樹
脂が代表なものであり、各種の基材と複合化して用いら
れている。[Prior Art] Typical resins used in metal foil-clad electrical laminates are phenol resins, epoxy resins, and unsaturated polyester resins, and are used in combination with various base materials.
一方でビニルエステル樹脂として公知の樹脂は、硬化体
の物性は優れるものの本発明の用途には広く用いられて
いない。On the other hand, resins known as vinyl ester resins have excellent physical properties when cured, but are not widely used for the purposes of the present invention.
既存のビニルエステル樹脂は分子間が数百から2000
程度であり、紙、ガラス基材への含浸および加熱加工を
行なう際に基材からの樹脂の流出が大きく、また他の七
ツマー類の添加に際しては粘度低下が著しい。Existing vinyl ester resins have molecules between several hundred to 2000
When impregnating and heating paper or glass substrates, the resin flows out from the substrate to a large extent, and when other heptamers are added, the viscosity decreases significantly.
かかる欠点を補う方法としてチキン粘性を付与するため
にシリカ等を配合する等の手段がとられる。しかし紙や
ガラス基材への含浸においてはチキン粘性の付与は基材
への含浸速度が下がるという欠点がある。As a method of compensating for such drawbacks, measures such as adding silica or the like to impart chicken viscosity are taken. However, when impregnating paper or glass substrates, imparting chicken viscosity has the disadvantage that the rate of impregnation into the substrate decreases.
またエポキシアクリレートが主体であるために比較的高
価でもあり広く使用されるに至っていない。Furthermore, since it is mainly composed of epoxy acrylate, it is relatively expensive and has not been widely used.
[発明が解決しようとする問題点]
本発明は、電気特性および機械的諸物性が均衡しており
、さらに各種の配合モノマーや添加物との混和性に優れ
、含浸加工に適した電気用積層板用樹脂組成物の提供を
目的とする。[Problems to be solved by the invention] The present invention provides an electrical laminate that has balanced electrical properties and mechanical properties, has excellent miscibility with various blended monomers and additives, and is suitable for impregnation processing. The purpose is to provide a resin composition for plates.
[問題点を解決するための手段]
本発明の前記目的は、先に特開昭60−38403号公
報において開示されている硬化性プレポリマー、すなわ
ち一般式
C式中、Aはビニルモノマーとアクリ[1イルモノマー
もしくはメタクリロイルモノマーとのランダム共重合体
主鎖部分を示し、Rは水素またはメチル基であり、X
およびX2はそれぞれ同一または異種であって炭素数2
〜16の炭化水素基、またはエーテル結合により連結し
た炭化水素基を示し、×1およびx2において酸素と結
合している炭素原子は1級もしくは2級である〕
にて示される、主鎖がビニル重合で得られたポリマーで
側鎖が2個のウレタン結合を介してアクリロイル基また
はメタクリロイル基r以下、両者を(メタ)アクリロイ
ル基と呼称」を有する硬化性プレポリマー10〜60重
量%を含有し、残部が架橋用ビニルモノマーから成る樹
脂配合液を主成分とする電気用積層板用樹脂組成物によ
って達成される。[Means for Solving the Problems] The object of the present invention is to produce a curable prepolymer previously disclosed in JP-A-60-38403, that is, in the general formula C, A is a vinyl monomer and an acrylic monomer. [Represents the main chain portion of a random copolymer with 1-yl monomer or methacryloyl monomer, R is hydrogen or a methyl group, and X
and X2 are each the same or different and have 2 carbon atoms
~ 16 hydrocarbon groups or hydrocarbon groups connected by ether bonds, and the carbon atoms bonded to oxygen in x1 and x2 are primary or secondary], and the main chain is vinyl The polymer obtained by polymerization contains 10 to 60% by weight of a curable prepolymer whose side chain has an acryloyl group or a methacryloyl group r or less, both of which are referred to as a (meth)acryloyl group, through two urethane bonds. This can be achieved by using a resin composition for electrical laminates, the main component of which is a resin mixture, the remainder of which is a crosslinking vinyl monomer.
[作 用]
本発明において、一般式[I]における主鎖ポリマーの
分子量は1万〜10万が好適であり、また一般式[I]
にて示される硬化性プレポリマーが樹脂組成物中に10
〜60ffiffi%含まれることにより、好ましい樹
脂組成物が得られることも分かった。[Function] In the present invention, the molecular weight of the main chain polymer in general formula [I] is preferably from 10,000 to 100,000, and in general formula [I]
A curable prepolymer represented by 10
It has also been found that a preferable resin composition can be obtained by containing ~60ffiffi%.
本発明の一般式[I]で表わされる硬化性プレポリマー
の製造方法としては、
(イ)ヒドロキシル基を含むモノマーを一成分とし、所
望のモノマーと共重合させて、側鎖にヒドロキシル基を
有するポリマーを合成する:(ロ)ジイソシアナートと
(メタ)アクリロイル基を有するる不飽和モノアルコー
ルとを1:1(モル比)で反応さゼて、反応生成物1分
子中に111i11のイソシアナートキと(メタ)アク
リロイル基とを共有する不飽和イソシアサートを合成し
、(ハ)溶剤またはモノマーに溶解した工程(イ)によ
る側鎖にヒドロキシル基を有するポリマーと、工程(ロ
)にJ:る不飽和イソシアナートとを、七ツマ−あるい
は溶剤溶液中で反応させる。The method for producing the curable prepolymer represented by the general formula [I] of the present invention includes (a) using a monomer containing a hydroxyl group as one component and copolymerizing it with a desired monomer to have a hydroxyl group in the side chain. Synthesize a polymer: (b) Diisocyanate and an unsaturated monoalcohol having a (meth)acryloyl group are reacted in a 1:1 (mole ratio) to form 111i11 isocyaners in one molecule of the reaction product. Synthesize an unsaturated isocyanate that shares a (meth)acryloyl group with a (meth)acryloyl group, (c) add a polymer having a hydroxyl group on the side chain in step (a) dissolved in a solvent or monomer, and add J to step (b): The unsaturated isocyanate is reacted with the unsaturated isocyanate in a solvent solution.
溶剤を用いた場合は任意の既知の方法で溶剤を除き、モ
ノマー溶液とすることが必要である。When a solvent is used, it is necessary to remove the solvent by any known method to obtain a monomer solution.
側鎖にヒドロキシル基を有するポリマーを合成するため
には、当然のことながらヒドロキシル基を有するモノマ
ーと一般の七ツマ−の共重合によらなければならない。In order to synthesize a polymer having a hydroxyl group in the side chain, it is necessary to copolymerize a monomer having a hydroxyl group with a general heptamer.
ヒドロキシル基を有する七ツマ−としては、2−とドロ
キシエチルアクリレート、2−ヒドロキシエチルメタク
リレート、2−ヒドロキシプロピルアクリレート、2−
ヒドロキシプロピルメタクリレート、メチロールアクリ
ルアミド等が代表的である。Examples of hydroxyl group-containing sevenmers include 2- and droxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, and 2-hydroxypropyl acrylate.
Typical examples include hydroxypropyl methacrylate and methylol acrylamide.
ヒドロキシル基を有するモノマーと共重合してポリマー
を形成させるためのごニルモノマーには例えば現在一般
に市販されているものとして次の種類が挙げられる:ス
チレン、α−メチルスチレン、クロロスチレン、ビニル
トルエン、アクリル酸エステル類(メチル−、エチル−
、ブチル−12−エチルへキシル−、オクチル−等)、
メタクリル酸エステル類(メチル−、エチル−、プロピ
ル−、ブチル−、イソブチル−1tert−ブチル、2
−エチルへキシル−、ラウリル−、ベンジル−、シクロ
ヘキシル−、テトラヒドロフルフリル−等)、酢酸ビニ
ル、プロピオン酸ビニル、バーサチック酸ビニル、塩化
ビニル、臭化ビニル、アクリロニトリル、エチレン、ブ
タジェン等。変性用としてアクリル酸、メタクリル酸も
利用できる。Examples of monomers that can be copolymerized with monomers having hydroxyl groups to form polymers include the following types that are currently commercially available: styrene, α-methylstyrene, chlorostyrene, vinyltoluene, acrylic. Acid esters (methyl, ethyl)
, butyl-12-ethylhexyl, octyl, etc.),
Methacrylic acid esters (methyl, ethyl, propyl, butyl, isobutyl, tert-butyl, 2
(ethylhexyl, lauryl, benzyl, cyclohexyl, tetrahydrofurfuryl, etc.), vinyl acetate, vinyl propionate, vinyl versatate, vinyl chloride, vinyl bromide, acrylonitrile, ethylene, butadiene, etc. Acrylic acid and methacrylic acid can also be used for modification.
工程(ア)の重合は、溶液重合が便利であり、そのまま
次の工程に進むことができるが、バール重合、塊状重合
により得られたポリマーをモノマーに溶解し、次の反応
に供することも実用的である。For the polymerization in step (a), solution polymerization is convenient and can proceed directly to the next step, but it is also practical to dissolve the polymer obtained by bar polymerization or bulk polymerization in monomer and use it for the next reaction. It is true.
側鎖に不飽和結合を有するポリマーを得る為の次の工程
(工程(イ)〕は、ポリマー側鎖のヒドロキシル基と不
飽和イソシアナートとの反応である。The next step (step (a)) for obtaining a polymer having unsaturated bonds in the side chain is the reaction of the hydroxyl group in the polymer side chain with an unsaturated isocyanate.
不飽和イソシアナートは(メタ)アクリロイル基を有す
る不飽和モノアルコールに、ジイソシアナートをヒドロ
キシル基とイソシアナート基の比率がモル比で実質的に
1:1になるにうに反応することにより合成される。Unsaturated isocyanates are synthesized by reacting diisocyanates with unsaturated monoalcohols having (meth)acryloyl groups such that the molar ratio of hydroxyl groups to isocyanate groups is substantially 1:1. Ru.
不飽和モノアルコールは前)ホした種類がそのまま適用
される。For unsaturated monoalcohols, the types listed above apply as is.
ジイソシアナートの種類としては、市販されている代表
的なものとして、2.4−トリレンジイソシアナート、
2.4−トリレンジイソシアナート(80重量%)と2
.6−トリレンジイソシアナート(20重1’fi%)
との混合イソシアナート、ジフェニルメタンジイソシア
ナート、ヘキサメチレンジイソシアナート、1,5−ナ
フチレンジイソシアナート、イソホロンジイソシアナー
ト、キシリレンジイソシアナート、水素化ジフェニルメ
タンジイソシアナート、水素化キシリレンジイソシアナ
ートが挙げられる。Typical commercially available diisocyanates include 2,4-tolylene diisocyanate,
2.4-Tolylene diisocyanate (80% by weight) and 2
.. 6-Tolylene diisocyanate (20wt 1'fi%)
mixed isocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, 1,5-naphthylene diisocyanate, isophorone diisocyanate, xylylene diisocyanate, hydrogenated diphenylmethane diisocyanate, hydrogenated xylylene diisocyanate Can be mentioned.
反応は、イソシアナートを溶剤またはモノマーに溶解し
ておき、不飽和アルコールを滴下することにより行なわ
れる。The reaction is carried out by dissolving the isocyanate in a solvent or monomer and adding the unsaturated alcohol dropwise.
溶剤を用いた場合は、普通溶剤をモノマーに置き換えな
ければならないが、それには沸点差(溶剤がより低沸点
)を利用して分留することにより行なわれる。モノマー
溶液の場合はそのまま利用しく7る。When a solvent is used, it is usually necessary to replace the solvent with a monomer, which is accomplished by fractional distillation taking advantage of the difference in boiling points (the solvent has a lower boiling point). In the case of a monomer solution, it can be used as is.
また本発明において使用する架橋用ごニルモノマーとし
ては、公知のものはいずれも使用可能であるが、これら
の中にはスチレン、α−メチルスチレン、p−メチルス
チレン、p−クロルスチレン、p−ビニルスチレンのよ
うな置換スチレン類;各種のアクリル酸またはメタアク
リル酸エステル類;エチレングリコールジアクリレート
、エチレングリコールジメタアクリレート、1.4−ブ
タンジオールジアクリレート、1,4−ブタンジオール
ジメタアクリレート、トリメチロールプロパントリアク
リレート、トリメチロールプロパントリメタアクリレー
ト等のビニル多官能アクリル酸またはメタアクリル酸エ
ステル類;ポリウレタンアクリレート、ポリウレタンメ
タアクリレート、ポリエーテルアクリレート、ポリエー
テルメタアクリレート等のビニル多官能オリゴエステル
類等が包含される。In addition, as the crosslinking monomer used in the present invention, any known ones can be used, but among these, styrene, α-methylstyrene, p-methylstyrene, p-chlorostyrene, p-vinyl Substituted styrenes such as styrene; various acrylic or methacrylic esters; ethylene glycol diacrylate, ethylene glycol dimethacrylate, 1,4-butanediol diacrylate, 1,4-butanediol dimethacrylate, Vinyl polyfunctional acrylic acid or methacrylic acid esters such as methylolpropane triacrylate and trimethylolpropane trimethacrylate; vinyl polyfunctional oligoesters such as polyurethane acrylate, polyurethane methacrylate, polyether acrylate, and polyether methacrylate, etc. Included.
[実施例]
以下、本発明を実施例によって詳しく述べるが、本発明
の要旨を逸脱しない限り、これらの実施例のみに限定さ
れるものではない。[Examples] Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited to these Examples unless it departs from the gist of the present invention.
この明細書を通して、温度は仝て℃であり、部および%
は特記しない限り重量基準である。Throughout this specification, temperatures are only in °C, parts and %
are based on weight unless otherwise specified.
なお、実施例の配合に用いた樹脂成分は次ぎのようであ
る。The resin components used in the formulation of the examples are as follows.
成分 (ア) ・
分子m約4万でスチレンと2−とドロキシエチルメタク
リレートから構成され主鎖(重量比率82%)および2
−ヒドロキシプロピルメタクリレートとトリレンジイソ
シアネートから成るビニル側鎖(重量比率8%)から成
る
硬化性プレポリマー
〔一般式[I]におけるR−メチル基、X 1=−CH
2−CH2−1
X −−CH2−CH−
CH3に該当〕
実施例
坪ff1135Q/m2のクラフト紙(10cmx10
Cm)を「ニカレデンS−305J (商品名、日本カ
ーバイド社製、メチロールメラミン)水溶液に浸してロ
ーうで絞り、120℃で30分乾燥した。得られた紙基
材中に11.6ffiffi%メラミンが展着した。Ingredients (A) - Molecule m is approximately 40,000 and is composed of styrene, 2- and droxyethyl methacrylate, and the main chain (weight ratio 82%) and 2-
- Curable prepolymer consisting of a vinyl side chain (8% by weight) consisting of hydroxypropyl methacrylate and tolylene diisocyanate [R-methyl group in general formula [I], X 1 = -CH
2-CH2-1 X --CH2-CH- Corresponds to CH3] Example: Kraft paper (10cm
Cm) was immersed in an aqueous solution of Nikaledene S-305J (trade name, manufactured by Nippon Carbide Co., Ltd., methylolmelamine), squeezed with a wax comb, and dried at 120°C for 30 minutes. has developed.
この紙を平皿中に入れた表1に示す組成の含浸用樹脂配
合液に浮かべて、液を含浸させた。This paper was placed in a flat plate and floated on an impregnating resin mixture having the composition shown in Table 1 to impregnate it with the liquid.
樹脂配合液を含んだ紙を6枚と市販接着剤付銅箔rMK
−56J (商品名、三井金属鉱業社製)を1枚重ね
合わせてセロハン袋に入れ、これを2枚の鉄板にはさみ
、30kOの重りをのせた。6 sheets of paper containing resin compound liquid and commercially available copper foil rMK with adhesive
-56J (trade name, manufactured by Mitsui Kinzoku Mining Co., Ltd.) was placed in a cellophane bag, sandwiched between two iron plates, and a 30 kO weight was placed on top.
120℃で1時間、さらに100℃で10時間硬化させ
た。得られた積層板は1.59〜1661mm厚であっ
た。It was cured at 120°C for 1 hour and then at 100°C for 10 hours. The resulting laminate had a thickness of 1.59 to 1661 mm.
l?1層板の特性値を表2に示す。l? Table 2 shows the characteristic values of the one-layer board.
表1 樹脂配合液組成
表2 積層板物性
*)1#φ孔×孔側41.785Il+ピツチで配列し
た金型で欠陥の生じなくなる温度。Table 1 Resin compound composition Table 2 Physical properties of laminate *) Temperature at which no defects occur in a mold arranged in 1#φ hole x hole side 41.785 Il+pitch.
[発明の効果1
本発明の電気用積層板用樹脂組成物は、電気特性、機械
的物性および打抜き特性に優れている。[Effect of the Invention 1 The resin composition for electrical laminates of the present invention has excellent electrical properties, mechanical properties, and punching properties.
Claims (1)
しくはメタクリロイルモノマーとのランダム共重合体主
鎖部分を示し、Rは水素またはメチル基であり、X_1
およびX_2はそれぞれ同一または異種であつて炭素数
2〜16の炭化水素基、またはエーテル結合により連結
した炭化水素基を示し、X_1およびX_2において酸
素と結合している炭素原子は1級もしくは2級である〕 にて示される、主鎖がビニル重合で得られたポリマーで
側鎖が2個のウレタン結合を介してアクリロイル基また
はメタクリロイル基を有する硬化性プレポリマー10〜
60重量%を含有し、 残部が架橋用ビニルモノマーから成る樹脂配合液を主成
分とする電気用積層板用樹脂組成物。(1) General formula ▲ Numerical formula, chemical formula, table, etc. ▼ [I] (In the formula, A represents the main chain portion of a random copolymer of vinyl monomer and acryloyl monomer or methacryloyl monomer, and R represents hydrogen or methyl group. and X_1
and X_2 are the same or different hydrocarbon groups having 2 to 16 carbon atoms, or hydrocarbon groups connected by an ether bond, and the carbon atoms bonded to oxygen in X_1 and X_2 are primary or secondary. ] Curable prepolymers 10 to 10 whose main chain is a polymer obtained by vinyl polymerization and whose side chain has an acryloyl group or a methacryloyl group via two urethane bonds.
A resin composition for electrical laminates, the main component of which is a resin compounded liquid containing 60% by weight and the remainder consisting of a crosslinking vinyl monomer.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26612986A JPS63120713A (en) | 1986-11-07 | 1986-11-07 | Resin composition for electrical laminate |
EP19870116323 EP0266775A3 (en) | 1986-11-07 | 1987-11-05 | Laminates |
US07/117,605 US4929494A (en) | 1986-03-05 | 1987-11-06 | Fibrous substrates impregnated with a curable composition |
CA000551251A CA1291017C (en) | 1986-11-07 | 1987-11-06 | Laminates useful in electrical devices |
KR870012568A KR880006050A (en) | 1986-11-07 | 1987-11-07 | Stack |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26612986A JPS63120713A (en) | 1986-11-07 | 1986-11-07 | Resin composition for electrical laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63120713A true JPS63120713A (en) | 1988-05-25 |
Family
ID=17426731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26612986A Pending JPS63120713A (en) | 1986-03-05 | 1986-11-07 | Resin composition for electrical laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63120713A (en) |
-
1986
- 1986-11-07 JP JP26612986A patent/JPS63120713A/en active Pending
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