JPS63119272U - - Google Patents

Info

Publication number

JPS63119272U

JPS63119272U JP1124587U JP1124587U JPS63119272U JP S63119272 U JPS63119272 U JP S63119272U JP 1124587 U JP1124587 U JP 1124587U JP 1124587 U JP1124587 U JP 1124587U JP S63119272 U JPS63119272 U JP S63119272U

Authority

JP

Japan

Prior art keywords

printed circuit

component mounting

hole

circuit board

mounting land

Prior art date

1987-01-27

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229910000679 solder Inorganic materials 0.000 claims description 10
• 239000006071 cream Substances 0.000 description 2
• 230000008018 melting Effects 0.000 description 2
• 238000002844 melting Methods 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1

Cited By (3)