JPS63119250U - - Google Patents
Info
- Publication number
- JPS63119250U JPS63119250U JP1987010398U JP1039887U JPS63119250U JP S63119250 U JPS63119250 U JP S63119250U JP 1987010398 U JP1987010398 U JP 1987010398U JP 1039887 U JP1039887 U JP 1039887U JP S63119250 U JPS63119250 U JP S63119250U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- metal wire
- semiconductor pellet
- flame
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987010398U JPS63119250U (Direct) | 1987-01-27 | 1987-01-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987010398U JPS63119250U (Direct) | 1987-01-27 | 1987-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63119250U true JPS63119250U (Direct) | 1988-08-02 |
Family
ID=30796650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987010398U Pending JPS63119250U (Direct) | 1987-01-27 | 1987-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63119250U (Direct) |
-
1987
- 1987-01-27 JP JP1987010398U patent/JPS63119250U/ja active Pending