JPS63119239U - - Google Patents
Info
- Publication number
- JPS63119239U JPS63119239U JP1987011304U JP1130487U JPS63119239U JP S63119239 U JPS63119239 U JP S63119239U JP 1987011304 U JP1987011304 U JP 1987011304U JP 1130487 U JP1130487 U JP 1130487U JP S63119239 U JPS63119239 U JP S63119239U
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- wire bonding
- identification display
- utility
- rear end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987011304U JPH0510363Y2 (US07122547-20061017-C00273.png) | 1987-01-28 | 1987-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987011304U JPH0510363Y2 (US07122547-20061017-C00273.png) | 1987-01-28 | 1987-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63119239U true JPS63119239U (US07122547-20061017-C00273.png) | 1988-08-02 |
| JPH0510363Y2 JPH0510363Y2 (US07122547-20061017-C00273.png) | 1993-03-15 |
Family
ID=30798396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987011304U Expired - Lifetime JPH0510363Y2 (US07122547-20061017-C00273.png) | 1987-01-28 | 1987-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510363Y2 (US07122547-20061017-C00273.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07231006A (ja) * | 1994-02-16 | 1995-08-29 | Nec Corp | ワイヤボンディング装置 |
| JP2011502232A (ja) * | 2007-10-29 | 2011-01-20 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電磁弁用のプランジャ、および、電磁弁用のプランジャの識別方法 |
-
1987
- 1987-01-28 JP JP1987011304U patent/JPH0510363Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07231006A (ja) * | 1994-02-16 | 1995-08-29 | Nec Corp | ワイヤボンディング装置 |
| JP2011502232A (ja) * | 2007-10-29 | 2011-01-20 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電磁弁用のプランジャ、および、電磁弁用のプランジャの識別方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0510363Y2 (US07122547-20061017-C00273.png) | 1993-03-15 |
