JPS63118209U - - Google Patents
Info
- Publication number
- JPS63118209U JPS63118209U JP916387U JP916387U JPS63118209U JP S63118209 U JPS63118209 U JP S63118209U JP 916387 U JP916387 U JP 916387U JP 916387 U JP916387 U JP 916387U JP S63118209 U JPS63118209 U JP S63118209U
- Authority
- JP
- Japan
- Prior art keywords
- magnetization
- demagnetizing
- amount
- electronic component
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005415 magnetization Effects 0.000 claims 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP916387U JPS63118209U (enExample) | 1987-01-24 | 1987-01-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP916387U JPS63118209U (enExample) | 1987-01-24 | 1987-01-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63118209U true JPS63118209U (enExample) | 1988-07-30 |
Family
ID=30794215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP916387U Pending JPS63118209U (enExample) | 1987-01-24 | 1987-01-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63118209U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024006586A (ja) * | 2022-07-04 | 2024-01-17 | 株式会社村田製作所 | 電子部品搭載装置、および電子部品搭載方法 |
-
1987
- 1987-01-24 JP JP916387U patent/JPS63118209U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024006586A (ja) * | 2022-07-04 | 2024-01-17 | 株式会社村田製作所 | 電子部品搭載装置、および電子部品搭載方法 |
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