JPS63115229U - - Google Patents

Info

Publication number
JPS63115229U
JPS63115229U JP1987007812U JP781287U JPS63115229U JP S63115229 U JPS63115229 U JP S63115229U JP 1987007812 U JP1987007812 U JP 1987007812U JP 781287 U JP781287 U JP 781287U JP S63115229 U JPS63115229 U JP S63115229U
Authority
JP
Japan
Prior art keywords
package
semiconductor device
view
sectional
amorphous glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987007812U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987007812U priority Critical patent/JPS63115229U/ja
Publication of JPS63115229U publication Critical patent/JPS63115229U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Light Receiving Elements (AREA)
JP1987007812U 1987-01-22 1987-01-22 Pending JPS63115229U (enFirst)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987007812U JPS63115229U (enFirst) 1987-01-22 1987-01-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987007812U JPS63115229U (enFirst) 1987-01-22 1987-01-22

Publications (1)

Publication Number Publication Date
JPS63115229U true JPS63115229U (enFirst) 1988-07-25

Family

ID=30791615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987007812U Pending JPS63115229U (enFirst) 1987-01-22 1987-01-22

Country Status (1)

Country Link
JP (1) JPS63115229U (enFirst)

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