JPS63114660U - - Google Patents
Info
- Publication number
- JPS63114660U JPS63114660U JP681487U JP681487U JPS63114660U JP S63114660 U JPS63114660 U JP S63114660U JP 681487 U JP681487 U JP 681487U JP 681487 U JP681487 U JP 681487U JP S63114660 U JPS63114660 U JP S63114660U
- Authority
- JP
- Japan
- Prior art keywords
- layered copper
- foils
- bandage
- copper foils
- pasted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- 239000011889 copper foil Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 230000003068 static effect Effects 0.000 claims 1
Landscapes
- Electrotherapy Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP681487U JPS63114660U (enExample) | 1987-01-19 | 1987-01-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP681487U JPS63114660U (enExample) | 1987-01-19 | 1987-01-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63114660U true JPS63114660U (enExample) | 1988-07-23 |
Family
ID=30789683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP681487U Pending JPS63114660U (enExample) | 1987-01-19 | 1987-01-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63114660U (enExample) |
-
1987
- 1987-01-19 JP JP681487U patent/JPS63114660U/ja active Pending