JPS63110052U - - Google Patents
Info
- Publication number
- JPS63110052U JPS63110052U JP1987001243U JP124387U JPS63110052U JP S63110052 U JPS63110052 U JP S63110052U JP 1987001243 U JP1987001243 U JP 1987001243U JP 124387 U JP124387 U JP 124387U JP S63110052 U JPS63110052 U JP S63110052U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- package
- semiconductor
- semiconductor device
- overlappingly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987001243U JPS63110052U (me) | 1987-01-08 | 1987-01-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987001243U JPS63110052U (me) | 1987-01-08 | 1987-01-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63110052U true JPS63110052U (me) | 1988-07-15 |
Family
ID=30778971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987001243U Pending JPS63110052U (me) | 1987-01-08 | 1987-01-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63110052U (me) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0325255U (me) * | 1989-07-21 | 1991-03-15 | ||
| JPH11262537A (ja) * | 1997-12-12 | 1999-09-28 | Ela Medical Sa | 能動植え込み型医療装置の電子回路ならびにその製造方法 |
-
1987
- 1987-01-08 JP JP1987001243U patent/JPS63110052U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0325255U (me) * | 1989-07-21 | 1991-03-15 | ||
| JPH11262537A (ja) * | 1997-12-12 | 1999-09-28 | Ela Medical Sa | 能動植え込み型医療装置の電子回路ならびにその製造方法 |