JPS63108646U - - Google Patents
Info
- Publication number
- JPS63108646U JPS63108646U JP20217486U JP20217486U JPS63108646U JP S63108646 U JPS63108646 U JP S63108646U JP 20217486 U JP20217486 U JP 20217486U JP 20217486 U JP20217486 U JP 20217486U JP S63108646 U JPS63108646 U JP S63108646U
- Authority
- JP
- Japan
- Prior art keywords
- package
- heat
- cut
- bent
- generating component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20217486U JPH0429569Y2 (sl) | 1986-12-27 | 1986-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20217486U JPH0429569Y2 (sl) | 1986-12-27 | 1986-12-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63108646U true JPS63108646U (sl) | 1988-07-13 |
| JPH0429569Y2 JPH0429569Y2 (sl) | 1992-07-17 |
Family
ID=31166309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20217486U Expired JPH0429569Y2 (sl) | 1986-12-27 | 1986-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0429569Y2 (sl) |
-
1986
- 1986-12-27 JP JP20217486U patent/JPH0429569Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0429569Y2 (sl) | 1992-07-17 |