JPS63108634A - Contactor - Google Patents

Contactor

Info

Publication number
JPS63108634A
JPS63108634A JP25427086A JP25427086A JPS63108634A JP S63108634 A JPS63108634 A JP S63108634A JP 25427086 A JP25427086 A JP 25427086A JP 25427086 A JP25427086 A JP 25427086A JP S63108634 A JPS63108634 A JP S63108634A
Authority
JP
Japan
Prior art keywords
contact
movable
contacts
movable contact
contact plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25427086A
Other languages
Japanese (ja)
Inventor
晃 本山
和久 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP25427086A priority Critical patent/JPS63108634A/en
Publication of JPS63108634A publication Critical patent/JPS63108634A/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 技術分野 本発明は、電磁!174器などに好適に用いられる接点
装置に関する。
[Detailed Description of the Invention] Technical Field The present invention relates to electromagnetic! The present invention relates to a contact device suitable for use in 174 devices and the like.

従来技術 第4図は興型的な従来技術の接点装置1の斜視図である
。第・S図を参照して、接点装置1の構成について工明
rる。なお、第・1図示の接、1ユ装置1は図示しない
ハフ′)ングによって全・木が気密に34止さね、てい
る。接、I′y、72置1′c′は、基台2上にコイル
3がri置され、このコイル3−\の;力付勢、/消勢
によって矢符A1方向または矢符A2方向に往復変位さ
れるアマチア4が設けられろ、このアマチア4に応動す
るカード5が設けられる。このカード5は可動接点板6
の遊端部側付近に臨み、可動接点板6の遊32部には可
動接点(図示せず)が設けられる。この可動接点と前記
矢符A1方向または矢符A2方向に対向する位nに、固
定接7代が設けられた接点板7,3が設けられる。また
前記アマチア4の往復変位を天現する磁路を構成rるた
めにヨーク9が設けられる。
Prior Art FIG. 4 is a perspective view of a conventional contact device 1. The structure of the contact device 1 will be explained with reference to FIG. It should be noted that the first unit shown in FIG. At the contact, I'y, 72 position 1'c', the coil 3 is placed on the base 2, and the coil 3-\ is moved in the arrow A1 direction or the arrow A2 direction by force energization/deenergization. An amatia 4 is provided which is reciprocated and a card 5 is provided which responds to the amacia 4. This card 5 has a movable contact plate 6
A movable contact (not shown) is provided in the free end portion 32 of the movable contact plate 6. Contact plates 7 and 3 each having seven fixed contacts are provided at a position n opposite to this movable contact in the direction of the arrow A1 or the direction of the arrow A2. Further, a yoke 9 is provided to form a magnetic path for causing the reciprocating displacement of the amatia 4.

以下、第4図を参照して、杢従米技術の接点装置1の動
作について説明する。フィル3は電力付勢されると励l
iaされ、アマ壬74およびカード5をたとえば矢符A
1方向に変位させ、このカード5が可動接点板6を矢符
A1方向に押圧して可動接点板6に設けられた前記可動
後ツユが接点板7の固定接点と接触する。またフィル3
が電力消勢されると、アマチア4およびカード5はたと
えば可動接点板6の弾性などによって矢符A2方向に復
帰し、可動接、α板6の可動接点が接点板8の固定接点
と接触する。このように可動接点板6の可動後、αが、
接点板7,8の固定接点と選択的に接触することにより
、接点板7,8の各固定接点間の切換えが実現され、電
力や電気信号などが、基台2に設けられた端子群10が
ら選択的に取出される。
Hereinafter, with reference to FIG. 4, the operation of the contact device 1 of the heather technique will be explained. Fill 3 is energized when energized
ia, and move Ama 74 and card 5 to arrow A, for example.
Displaced in one direction, this card 5 presses the movable contact plate 6 in the direction of arrow A1, and the movable rear tip provided on the movable contact plate 6 comes into contact with the fixed contacts of the contact plate 7. Also Phil 3
When the power is turned off, the amachia 4 and the card 5 return in the direction of the arrow A2 due to the elasticity of the movable contact plate 6, and the movable contact of the α plate 6 comes into contact with the fixed contact of the contact plate 8. . After moving the movable contact plate 6 in this way, α becomes
By selectively contacting the fixed contacts of the contact plates 7 and 8, switching between the fixed contacts of the contact plates 7 and 8 is realized, and power, electrical signals, etc. are transferred to the terminal group 10 provided on the base 2. selectively taken out.

このような構成を有する密封形の接、ζ装置1では、長
時間の使用により昇温することによって、コイル3のコ
イル巻線に塗布されたfとえばパラフィンなどが揮発し
てパラフィンがスが発生し、また接点装置1に用いられ
ているPBT樹脂に含まれるたとえばポリメチルリン酸
などの有機〃スが発生する。このような有W1〃スは接
点間閉時に発生するアークのエネルギによって炭化し、
この炭化物が可動接点板6や接点板7.8に形成されて
いる接点に付着し、この付着した炭化物がさらに前記有
機〃スを吸着しつつ炭化され、凝縮しつつ成長する。
In the sealed type contact device 1 having such a configuration, as the temperature rises due to long-term use, the f, such as paraffin, applied to the coil winding of the coil 3 evaporates, causing the paraffin to evaporate. In addition, organic gases such as polymethyl phosphoric acid contained in the PBT resin used in the contact device 1 are also generated. Such a presence W1 is carbonized by the energy of the arc generated when the contacts are closed,
This carbide adheres to the contacts formed on the movable contact plate 6 and the contact plate 7.8, and the adhered carbide further adsorbs the organic gas and becomes carbonized, condensing and growing.

このような炭化物が接点間に介在することによって、接
点間の接触抵抗が増大してしまう、またこのような接点
間のギャップは、たとえば1 m+s以内に設定されて
おり、したがって上記炭化物が過度に成長すると、離間
状態の可動接点と固定接点とを橋絡させ、接点装(i!
1の開閉動作を損なってしまうことになる。
The presence of such carbides between the contacts increases the contact resistance between the contacts, and the gap between such contacts is set to, for example, less than 1 m+s, so that the carbides are excessively present. As it grows, it bridges the separated movable contact and fixed contact, forming a contact assembly (i!
This will impair the opening/closing operation of No. 1.

またこのような接点装置が、前述した気密のハウジング
を備えていないいわゆる解放形の場合、はんだ付は作業
などに伴い、7ラツクスなどが上記接点間に侵入し、や
はり橋絡現象を発生させてしまう。
Furthermore, if such a contact device is a so-called open type that does not have the above-mentioned airtight housing, during soldering work etc., particles such as 7 lux may enter between the contacts and cause a bridging phenomenon. Put it away.

目   的 本発明の目的は、上述の問題点を解決し、接点間の接触
抵抗を抑制し、信頼性の向上および長寿命化を図るよう
にした接点装置を提供することである。
Purpose An object of the present invention is to provide a contact device that solves the above-mentioned problems, suppresses contact resistance between contacts, and improves reliability and extends life.

実施例 第2図は本発明の一実施例の接点装Wlllの構成を示
す斜視図である。第2図を参照して本実施例の構成につ
いて説明する。接点装W111は電気絶縁性材料から形
成される基台12を有しており、基台12の一方側には
複数の端子群13が設けられ、また基台12の反対側表
面には、後述するような構成を有する電磁石装置が設け
られ、これらはハウジング14によって気密に封止され
る。
Embodiment FIG. 2 is a perspective view showing the structure of a contact device Wllll according to an embodiment of the present invention. The configuration of this embodiment will be explained with reference to FIG. The contact device W111 has a base 12 made of an electrically insulating material, and one side of the base 12 is provided with a plurality of terminal groups 13, and the opposite surface of the base 12 is provided with terminals 13, which will be described later. An electromagnetic device having such a configuration is provided, which is hermetically sealed by a housing 14.

ハウジング14内にはフィル15が載置され、このコイ
ル15への電力付勢/消勢によって矢符B1方向または
矢符B2方向に往復変位される77チ716が設けられ
る。このアマチア16には、電気絶縁性材料から成るカ
ード17が接続され、このカード17によって矢符B1
方向に押圧され、この押圧力が解除された後には自身の
弾性力によって矢符B2方向に復帰する可動接点板18
が設けられる。
A fill 15 is placed in the housing 14, and a 77-chip 716 is provided that is reciprocated in the direction of arrow B1 or B2 by energizing/deenergizing the coil 15. A card 17 made of electrically insulating material is connected to this amatia 16, and this card 17 allows the arrow B1 to be
The movable contact plate 18 is pressed in the direction shown in FIG.
is provided.

可動接点板18の道端g側は、その長手方向に沿って形
成されたq欠きW419によって、幅方向(第2図上下
方向)に区分され、 一対の脚部20゜21が形成され
る。この脚部20.21の道端部付近には、後述する可
動接点が設けられ、この可動接点と矢符B1方向または
矢符B2方向に対向する位置に、後述する固定接点をそ
れぞれ有する固定接点板22.23がそれぞれ設けられ
る。また前記アマチア16の矢符B1方向または矢符B
2方向の往復変位を実現する磁路を構成するためのヨー
ク34が設けられる。
The road end g side of the movable contact plate 18 is divided in the width direction (in the vertical direction in FIG. 2) by a q notch W419 formed along its longitudinal direction, and a pair of leg portions 20° and 21 are formed. A movable contact, which will be described later, is provided near the roadside of this leg 20.21, and a fixed contact plate having fixed contacts, which will be described later, at positions facing the movable contact in the direction of arrow B1 or the direction of arrow B2, respectively. 22 and 23 are provided respectively. Also, the arrow B1 direction of the Amatia 16 or the arrow B
A yoke 34 is provided to configure a magnetic path that realizes reciprocating displacement in two directions.

第1図は第2図示の固定接点板23および可動接点板1
8の脚部20.21付近の拡大斜視図である。第1図を
併せて参照して、接点装置11の構成について詳述する
。前述したように脚部20゜21の道端部側には、板状
である脚部20.21の両表面に可動接点24a、24
b;25a、25b(総称する場合には参照符24.’
251:’示す)が、たとえば溶接などによってそれぞ
れ固定される。二跣らの可動接点24.25は、その形
状がいわゆるかまぼこ形であり、この可動接点24.2
5よりさらに道端部側には固定接点板23へ向けて凸に
曲成された曲成部26.27が設けられる。
Figure 1 shows the fixed contact plate 23 and the movable contact plate 1 shown in Figure 2.
8 is an enlarged perspective view of the vicinity of the leg portion 20.21 of FIG. The configuration of the contact device 11 will be described in detail with reference to FIG. As mentioned above, movable contacts 24a and 24 are provided on both surfaces of the plate-shaped leg portions 20.21 on the roadside side of the leg portions 20.21.
b; 25a, 25b (reference mark 24.' when used collectively)
251:') are respectively fixed by, for example, welding. The two movable contacts 24.25 have a so-called semicylindrical shape, and the movable contacts 24.2
Bent portions 26 and 27 are provided further toward the roadside than 5, which are curved in a convex manner toward the fixed contact plate 23.

一方、可動接点24.25が接触/離反する固定接点2
8が、固定接点板23の可動接点板18側に設けられる
。この固定接点28の形状もいわゆるかまぼこ形である
いこの固定接点28は可動接点25a、25bに臨んで
おり、前記曲成部26゜27に臨む固定接点板23の部
分には可動接点板18@へ向けて凸に曲成された曲成g
29が設けられる。
On the other hand, the fixed contact 2 with which the movable contacts 24 and 25 come into contact/separate
8 is provided on the movable contact plate 18 side of the fixed contact plate 23. The shape of this fixed contact 28 is also so-called semicylindrical. This fixed contact 28 faces the movable contacts 25a and 25b, and the movable contact plate 18@ A convexly curved curve g toward
29 is provided.

この曲成部26,27;29の少なくともいずれか一方
の相互に臨む側に(本実施例では曲成部29側に)、第
1図に二重斜線を付して示すように、不純物ガスを吸着
する物質であるリン酸エステルP O(OH20R)、
POOH(OR)2、PO(OR)3、(R;アルキル
基)などを塗布して、有機物塗膜層30を形成する。前
記リン酸エステルは、たとえばリン酸トリメチルエステ
ルP O(OCHsL’tどであってもよい。またこの
有機物塗膜130を形成するに代えて、可動接、α24
a、24bの少な(ともいずれが一方(本実施例で1土
可動接点24b、第1図に二重斜線を付して示す)に接
点潤滑剤などを塗布するようにしてらよい。
At least one of the curved portions 26, 27; 29 is provided with an impurity gas on the side facing each other (in this embodiment, on the curved portion 29 side), as shown with double hatching in FIG. Phosphate ester P O (OH20R), which is a substance that adsorbs
An organic coating layer 30 is formed by coating POOH(OR)2, PO(OR)3, (R; alkyl group), and the like. The phosphoric acid ester may be, for example, phosphoric acid trimethyl ester PO (OCHsL't).Also, instead of forming this organic coating film 130, movable contact, α24
A contact lubricant or the like may be applied to one of the movable contacts a and 24b (in this embodiment, the movable contact 24b is shown with double hatching in FIG. 1).

このような構成の接点装置11では、接点開閉時に発生
するアークは接点間を曲成部26,27;29側へ向け
て延びるので、前記曲成部26,27;29は高温とな
り、有は物塗膜層301.1容易に炭化する。この炭化
後の多孔質物質は、ハウジング14内の上記有擁物ガス
を吸着し、従来技術で指摘したような問題点が発生する
ことを防いでいる。また前記アークによって、可動接点
24a。
In the contact device 11 having such a configuration, the arc generated when the contacts are opened and closed extends between the contacts toward the bent portions 26, 27; 29, so the bent portions 26, 27; Material coating layer 301.1 carbonizes easily. This porous material after carbonization adsorbs the above-mentioned retained gas in the housing 14, thereby preventing the problems pointed out in the prior art from occurring. Moreover, the movable contact 24a is caused by the arc.

24bの少なくともいずれが一方に塗布さjl、piq
記接点接点潤滑剤温される場合であっても、同様の効果
を得ることができる。
At least any of 24b is applied to one side.jl, piq
Similar effects can be obtained even when the contact lubricant is heated.

第3図は本発明の他の実施例の接点装置の一部分の拡大
斜視図である。本実施例は前述の実施例に類似し、対応
する部分には同一の参照符を付す。
FIG. 3 is an enlarged perspective view of a portion of a contact device according to another embodiment of the present invention. This embodiment is similar to the previous embodiment, and corresponding parts are given the same reference numerals.

本実施例の注目すべき点は、可動接点板18の鐸711
20.21の道端部を固定接点板23gAに折曲げて屈
曲部31.32を形成し、この屈曲部31゜32の固定
接点板23と反対側表面に、前述の実施例と同様なたど
えぼリン酸エステルなどがら成る有機物塗膜層30を形
成する8 本たこの有機物塗膜層30に対向する位置に、半導体レ
ーザ素子33を設け、この半導体レーザ素子33からの
レーザ光を屈曲部31.32の有機物塗膜層30に照射
し、昇温させて前記炭化過程を進行させる6 前記半導体レーザ素子33のレーザ光の発生は、たとえ
ば前記コイル15への供給電力の付勢/消勢に同期して
行なうようにしてもよい、t、たこのようなレーザ素子
33からのレーザ光によって、有機物塗膜層30を予め
炭化させるようにして°らよい、このような構成によっ
ても、前述の実施例で述べた効果と同様の効果を得るこ
とができる。
The noteworthy point of this embodiment is that the bell 711 of the movable contact plate 18
The road end portion of 20.21 is bent to the fixed contact plate 23gA to form a bent portion 31.32, and the surface of the bent portion 31. A semiconductor laser element 33 is provided at a position facing the organic coating layer 30 of eight octopuses forming the organic coating layer 30 made of Ebophosphoric acid ester, etc., and the laser beam from the semiconductor laser element 33 is directed to the bent portion. 31. The organic coating layer 30 of 32 is irradiated and heated to advance the carbonization process. 6 Generation of laser light from the semiconductor laser element 33 is achieved by, for example, energizing/deenergizing the power supplied to the coil 15. The organic coating layer 30 may be carbonized in advance by the laser beam from the laser element 33, which is similar to the above. Effects similar to those described in the embodiment can be obtained.

効  果 以」二のように本発明に従えば、ハウジング内に気蜜に
固定接点と可動接点とが収納された接点装置において、
固定接点または可動接点の少なくども一方の近傍の昇温
領域に、該昇温によってハウジング内の不純物f入を吸
着する物質を塗布するようにした。したがって、接点装
置の接点開閉動作によってハウジング内に不純物がスが
発生しても、前記塗布物質によってこの不純物がスが吸
着される。したがって、このような不純物ガスが固定接
点と可動接点となどに付着して、アークにょる昇温なと
で炭化し、炭化物質がさらに不純物がスを@着してさら
に炭化されるなどの過程を繰返して成長し、接点装置の
性能を低下させる事態を防ぐようにできる。
According to the present invention as described in "Effects" 2, in a contact device in which a fixed contact and a movable contact are neatly housed in a housing,
A substance that adsorbs impurities in the housing due to the temperature increase is applied to a temperature increase region near at least one of the fixed contact and the movable contact. Therefore, even if impurities are generated in the housing due to the contact opening/closing operations of the contact device, the impurities are adsorbed by the coating material. Therefore, such impurity gas adheres to the fixed contacts and movable contacts, and is carbonized due to the temperature rise caused by the arc, and the carbonized substance is further carbonized as impurities adhere to it. It is possible to prevent the situation from repeatedly growing and deteriorating the performance of the contact device.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例に従う可動接点板18および
固定接点板23付近の拡大斜視図、第2図は本発明の一
実施例の接点装置11の一部切欠き斜視図、第3図は本
発明の他の実施例に従う可動接点板18および固定接点
板23付近の拡大斜視図、第4図は従来技術の接点装r
a1の斜視図で2)る。 11・・・接点装置、14・・・バー7ゾング、18・
・・可動接点板、22.23・・・固定接点板、24.
25・・・可動接点、28・・・固定接点、30・・・
有機物塗膜層、33・・・半導体レーザ素子
FIG. 1 is an enlarged perspective view of the vicinity of a movable contact plate 18 and a fixed contact plate 23 according to an embodiment of the present invention, FIG. 2 is a partially cutaway perspective view of a contact device 11 according to an embodiment of the present invention, and FIG. The figure is an enlarged perspective view of the vicinity of the movable contact plate 18 and the fixed contact plate 23 according to another embodiment of the present invention, and FIG.
2) is a perspective view of a1. 11... Contact device, 14... Bar 7 zone, 18...
...Movable contact plate, 22.23...Fixed contact plate, 24.
25... Movable contact, 28... Fixed contact, 30...
Organic coating layer, 33... semiconductor laser element

Claims (3)

【特許請求の範囲】[Claims] (1)固定接点と可動接点とがハウジング内に気密に収
納された接点装置であつて、 固定接点または可動接点の少なくとも一方の近傍の昇温
領域に、該昇温によつてハウジング内の不純物ガスを吸
着する物質を塗布したことを特徴とする接点装置。
(1) A contact device in which a fixed contact and a movable contact are hermetically housed in a housing, in which impurities in the housing are deposited in a temperature raised area near at least one of the fixed contact or the movable contact due to the temperature rise. A contact device characterized by being coated with a substance that adsorbs gas.
(2)上記不純物ガスを吸着する物質は、リン酸エステ
ル化合物であることを特徴とする特許請求の範囲第1項
記載の接点装置。
(2) The contact device according to claim 1, wherein the substance that adsorbs the impurity gas is a phosphoric acid ester compound.
(3)上記リン酸エステル化合物はリン酸トリメチルエ
ステルPO(OCH_3)_3であることを特徴とする
特許請求の範囲第1項記載の接点装置。
(3) The contact device according to claim 1, wherein the phosphoric acid ester compound is phosphoric acid trimethyl ester PO(OCH_3)_3.
JP25427086A 1986-10-25 1986-10-25 Contactor Pending JPS63108634A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25427086A JPS63108634A (en) 1986-10-25 1986-10-25 Contactor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25427086A JPS63108634A (en) 1986-10-25 1986-10-25 Contactor

Publications (1)

Publication Number Publication Date
JPS63108634A true JPS63108634A (en) 1988-05-13

Family

ID=17262636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25427086A Pending JPS63108634A (en) 1986-10-25 1986-10-25 Contactor

Country Status (1)

Country Link
JP (1) JPS63108634A (en)

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