JPS63108516A - Structure of protecting film for thin film magnetic head - Google Patents
Structure of protecting film for thin film magnetic headInfo
- Publication number
- JPS63108516A JPS63108516A JP25343986A JP25343986A JPS63108516A JP S63108516 A JPS63108516 A JP S63108516A JP 25343986 A JP25343986 A JP 25343986A JP 25343986 A JP25343986 A JP 25343986A JP S63108516 A JPS63108516 A JP S63108516A
- Authority
- JP
- Japan
- Prior art keywords
- film
- gap
- protecting film
- magnetic head
- magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010408 film Substances 0.000 title claims abstract description 56
- 239000010409 thin film Substances 0.000 title claims abstract description 22
- 239000004020 conductor Substances 0.000 claims abstract description 22
- 239000011810 insulating material Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 230000001681 protective effect Effects 0.000 claims description 31
- 238000010030 laminating Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 23
- 238000009413 insulation Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 230000006378 damage Effects 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 239000002365 multiple layer Substances 0.000 description 2
- 229910000889 permalloy Inorganic materials 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910000702 sendust Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/313—Disposition of layers
- G11B5/3133—Disposition of layers including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野〕
この発明は、薄膜磁気ヘッドを保護ケる保護膜の構造に
関し、導体コイルの有機絶縁材の熱膨張の彰費が各部に
及ばないようにしたものである。[Detailed Description of the Invention] (Industrial Application Field) This invention relates to the structure of a protective film that protects a thin-film magnetic head, so that the effects of thermal expansion of the organic insulating material of the conductor coil do not reach each part. This is what I did.
磁気ディスク等の磁気記録媒体への情報の記録・再生に
使用する磁気ヘッドのひとつに薄膜磁気ヘッドがある。A thin film magnetic head is one of the magnetic heads used for recording and reproducing information on magnetic recording media such as magnetic disks.
この薄膜磁気ヘッドは、フォトリソグラフィ技術を用い
て磁性層や導体コイルを成膜したものであり、製法上、
バルク形磁気ヘッドを機械加工で製作するのに比べ、寸
法の微小化に適するほか、高周波損失やマルチトラック
とした場合のトラック間漏洩が少ないなどの特徴がある
。This thin-film magnetic head uses photolithography technology to form magnetic layers and conductor coils, and due to the manufacturing method,
Compared to manufacturing bulk magnetic heads by machining, this method is suitable for miniaturization, and has features such as low high-frequency loss and low inter-track leakage when used with multi-tracks.
このような薄膜磁気ヘッドの製造は、第６図に工程を示
すように、まず、磁性基板あるいは非磁性基板１の上に
下部磁性層２となるパーマロイやセンダスト等を蒸着あ
るいはスパッタリング等で成膜し、この下部磁性層２上
にギャップを形成するための非磁性体３を積層したのち
、居間絶縁用の無撮絶縁材（ Ｓ Ｌ Ｏ ２ 、 Ａ
Ｉ□０３等》あるいは有機絶縁材４中にアルミニウム
．銅あるいは銀等の導電体のコイルをスパッタリング．
ミーリングおよびスピンコート等の１１ｇ！積層手段と
フォトリソグラフィによって成膜して導体コイル５とし
、次いで，この上に再びパーマロイやセンダスト等の磁
性体を蒸着やスパッタリング等で成膜したのち、所定の
形状にフォトリソグラフィ、ミーリングおよびエツチン
グ等で加工して上部磁性層６を形成し、これら各層を保
護するため最後に保護層７を積層するようにしている。To manufacture such a thin-film magnetic head, as shown in the steps shown in FIG. 6, first, a film such as Permalloy or Sendust, which will become the lower magnetic layer 2, is formed on a magnetic substrate or a non-magnetic substrate 1 by vapor deposition or sputtering. After laminating a non-magnetic material 3 to form a gap on the lower magnetic layer 2, a non-magnetic insulating material (S L O 2 , A) for living room insulation is laminated.
I□03 etc.] or aluminum in the organic insulating material 4. Sputtering a coil of conductive material such as copper or silver.
11g for milling and spin coating! A film is formed by laminating means and photolithography to form the conductor coil 5, and then a magnetic material such as permalloy or sendust is again formed on this film by vapor deposition or sputtering, and then photolithography, milling, etching, etc. are performed to form a predetermined shape. The upper magnetic layer 6 is formed by processing, and a protective layer 7 is finally laminated to protect each of these layers.
このような薄膜磁気ヘッドは、磁気記録装置の小形化や
高記録密度化にともない導体コイル５を多層に積層し、
コイル巻数を増加することが行なわれるが、このコイル
巻数の増加により、コイルの抵抗が増大し、書込み時の
電流によってコイルからの発熱量が多くなる。As magnetic recording devices become smaller and recording density increases, such thin-film magnetic heads stack conductor coils 5 in multiple layers.
The number of turns of the coil is increased, but this increase in the number of turns of the coil increases the resistance of the coil and increases the amount of heat generated from the coil due to the current during writing.
特に、導体コイル５の層間絶縁用として有機絶縁材４を
使用した場合、伝熱特性が悪いため有機絶縁材４自体の
温度が上昇してしまい、熱膨張が起こる。In particular, when the organic insulating material 4 is used for interlayer insulation of the conductor coil 5, the temperature of the organic insulating material 4 itself increases due to poor heat transfer characteristics, causing thermal expansion.
一方、この有機絶縁材４の上下に積層されている下部磁
性１１２や上部磁性層６および保護膜７が無機材料であ
るため熱膨張係数が異なり、有機絶縁材４によって上部
磁性層２のギャップ側の傾斜面が押され、ヘッドスライ
ダから突き出して磁気ディスク等の磁気記録媒体の損傷
や破壊を招いたり、出力変動等の原因となる。On the other hand, since the lower magnetic layer 112, the upper magnetic layer 6, and the protective film 7 layered above and below the organic insulating material 4 are inorganic materials, their thermal expansion coefficients are different. The inclined surface of the head is pushed and protrudes from the head slider, causing damage to or destruction of the magnetic recording medium such as a magnetic disk, or causing output fluctuations.
特に、浮上型薄膜磁気ヘッドを低浮上で使用する場合に
は、これらの問題が顕著となる。These problems become particularly noticeable when a flying thin film magnetic head is used at a low flying height.
この発明は、かかる従来技術の問題点に鑑みてなされた
もので、導体コイルの発熱による熱膨張等の影響が各部
に及ばないようにした薄膜磁気ヘッドの保護膜の構造を
提供しようとするものである。This invention has been made in view of the problems of the prior art, and aims to provide a protective film structure for a thin-film magnetic head that prevents the various parts from being affected by thermal expansion caused by heat generated by a conductor coil. It is.
上記問題点を解決するためこの発明は、基板上に成膜積
層されて構成された薄膜磁気ヘッドを保護する保護膜に
おいて、導体コイルの居間に設けられる有機絶縁材の熱
膨張をギャップ基端側に逃がすよう簿膜磁気ヘッドの最
上層のギャップ先端側の一部に保護膜を設けたことを特
徴とするものである。In order to solve the above-mentioned problems, the present invention aims to reduce the thermal expansion of the organic insulating material provided in the living area of the conductor coil to the base end of the gap in a protective film that protects a thin film magnetic head configured by laminating films on a substrate. This is characterized in that a protective film is provided on a part of the top layer of the film magnetic head on the tip side of the gap so as to allow the air to escape.
薄膜磁気ヘッドを覆うよう設けられる保護膜をヘッド最
−Ｅのギャップ先端側の一部にだけ積層し、導体コイル
の発熱による層間絶縁用の有機絶縁材の熱膨張を保：Ｉ
膜を積層しない部分に逃がすようにして吸収し、上部磁
性層のギＶツブ先端側の突き出し等の悪影響を防止する
ようにしている。A protective film provided to cover the thin-film magnetic head is laminated only on a part of the end of the gap at the end of the head to prevent thermal expansion of the organic insulating material for interlayer insulation due to heat generated by the conductor coil.
The absorption is made so that the film escapes to the part where the film is not laminated, thereby preventing adverse effects such as protrusion of the top end of the V-tube of the upper magnetic layer.
以下、この発明の一実施例を図面に基づき詳細に説明す
る。Hereinafter, one embodiment of the present invention will be described in detail based on the drawings.
第１図〜第３図はこの発明の薄膜磁気ヘッドの保護膜の
構造の一実施例にかかり、第１図は斜視図、第２図は平
面図、第３図は断面図である。1 to 3 show an embodiment of the structure of a protective film of a thin film magnetic head of the present invention, in which FIG. 1 is a perspective view, FIG. 2 is a plan view, and FIG. 3 is a sectional view.
この発明の保２Ｉ膜の構造が適用されるＪ膜磁気ヘッド
１０は、従来と同様に、磁性基板あるいは非磁性基板１
上に下部磁性層２が成膜され、ギャップを形成する非磁
性体３を介して居間絶縁用の有機絶縁材４中に単層また
は複数層（図示例では、２層）の導体コイル５を成膜し
、この上に先端部がギＶツブ用の非磁性体３上に位置し
、中間部が有機絶縁材４上に位置するようとともに、基
端部に下部磁性層２上に位置する結合部６ａが形成され
て磁路を形成するよう上部磁性層６が成膜されている。The J-film magnetic head 10 to which the structure of the 2I film of the present invention is applied has a magnetic substrate or a non-magnetic substrate.
A lower magnetic layer 2 is formed thereon, and a single-layer or multiple-layer (in the illustrated example, two layers) conductor coil 5 is formed in an organic insulating material 4 for living room insulation through a non-magnetic material 3 that forms a gap. A film is formed on this, with the tip part being located on the non-magnetic material 3 for the V-tip, the middle part being located on the organic insulating material 4, and the base end part being located on the lower magnetic layer 2. An upper magnetic layer 6 is formed so that a coupling portion 6a is formed to form a magnetic path.
このような薄膜磁気ヘッド１０では、導体コイル５の上
部磁性層６の外側に位置する部分が有様絶縁材４で覆わ
れた状態で露出しており、その他の部分は非磁性基板１
が露出した状態となっている。In such a thin film magnetic head 10, the portion of the conductor coil 5 located outside the upper magnetic layer 6 is exposed while being covered with the insulating material 4, and the other portion is covered with the nonmagnetic substrate 1.
is exposed.
この薄膜磁気ヘッド１０の最上層に設けられる保護膜１
１は、上面全体に積層されることなく一部に積層されて
おり、上部磁性層６の結合部６ａよりギャップ先端側（
第２図の下側）だけを覆うようになっており、非磁性基
板１．導体コイル５の有機絶縁材４および上部磁性層６
の一部を保護している。A protective film 1 provided on the top layer of this thin film magnetic head 10
1 is not laminated on the entire upper surface but is laminated on a part of the upper surface, and is located closer to the tip of the gap (
The non-magnetic substrate 1. Organic insulating material 4 and upper magnetic layer 6 of conductor coil 5
protects a part of it.
この保護膜１１としては、例えばアルミナ（Ａ１２０３
）などの絶縁性セラミック等無様物が使用され、スパッ
タリング等で成膜される。As this protective film 11, for example, alumina (A1203
) and other insulating ceramics are used, and the film is formed by sputtering or the like.
この保護膜１１は、例えば第４図に示すように、ウェフ
ァ上に形成された導体コイル５および上部磁性層６等各
簿躾磁気ヘッド１０の配列に対応して窓が形成されたス
テンレス等のハードマスク１２をウェファ上に密着して
スパッタリングを行なうことで成膜される。For example, as shown in FIG. 4, this protective film 11 is made of stainless steel or the like in which windows are formed corresponding to the arrangement of each magnetic head 10 such as the conductor coil 5 and upper magnetic layer 6 formed on the wafer. The film is formed by sputtering the hard mask 12 in close contact with the wafer.
こうしてハードマスク１２を用いてスパッタリングする
と、第５図に示すように、ハードマスク１２の窓の周囲
からゆるやかな傾斜を描いて保護膜１１が成膜される。When sputtering is performed using the hard mask 12 in this manner, the protective film 11 is formed with a gentle slope from the periphery of the window of the hard mask 12, as shown in FIG.
こののち、ギャップ側の端面（スライダ面）を研磨して
第１図に示すような保護膜１１が得られる。Thereafter, the end face (slider face) on the gap side is polished to obtain a protective film 11 as shown in FIG.
こうして一部分に保護膜１１が積層された薄膜磁気ヘッ
ド１０では、導体コイル５への通電による発熱は、保護
ｌ９１１で覆われた導体コイル５部分で起こり、この熱
は主に保護膜１１と非磁性基板１を伝わる。In the thin film magnetic head 10 in which the protective film 11 is partially laminated in this manner, heat generated by energizing the conductor coil 5 occurs in the portion of the conductor coil 5 covered with the protective layer 1911, and this heat is mainly generated between the protective film 11 and the non-magnetic layer. It is transmitted through the substrate 1.
このため温度上昇は薄膜磁気ヘッド１０のギャップ先端
側（第２図の下側）からギャップ基端側（第２図の上側
）に向って高くなり、熱膨張の影響も大きくなる。Therefore, the temperature rise increases from the tip end of the gap (lower side in FIG. 2) to the base end of the gap (upper side in FIG. 2) of the thin film magnetic head 10, and the influence of thermal expansion also increases.
したがって、保；［１１１に加わる応力も膜厚に比例し
、ギャップ基端側の方が大きくなるが、この保護膜１１
は上部磁性層６の結合部６ａよりギャップ基端側には成
膜されず、しかも、結合部６ａ付近では、傾斜面となっ
て次第に薄くなっているので、応力の発生が抑えられる
。Therefore, the stress applied to the protective film 111 is also proportional to the film thickness, and is larger on the gap base end side.
is not formed closer to the base end of the gap than the coupling portion 6a of the upper magnetic layer 6, and in addition, near the coupling portion 6a, it becomes an inclined surface and becomes gradually thinner, so that the generation of stress can be suppressed.
そして、導体コイル５の発熱による有＾絶縁材４の熱膨
張による応力は、保護膜１１が形成されていない部分に
逃げ、吸収されることとなり、上部磁性層６は非磁性基
板１上面に密着された保護膜１１で押えられ、ギャップ
先端側に突き出すことが防止される。The stress caused by the heat generated by the conductor coil 5 and the thermal expansion of the insulating material 4 escapes to the part where the protective film 11 is not formed and is absorbed, and the upper magnetic layer 6 is brought into close contact with the upper surface of the non-magnetic substrate 1. It is held down by the protective film 11 and is prevented from protruding toward the tip end of the gap.
これは、保護膜１１として使用するアルミナ等の無機物
の弾性係数に比べ、導体コイル５の層間絶縁用の有機絶
縁材４、例えばレジストやポリイミド等の弾性係数が比
較的小さく、有機絶縁材４の熱膨張の影響がギャップ側
（スライダ面）と反対側のギャップ基端側に向うことに
なるためである。This is because the elastic modulus of the organic insulating material 4 for interlayer insulation of the conductor coil 5, such as resist or polyimide, is relatively small compared to the elastic modulus of the inorganic material such as alumina used as the protective film 11. This is because the influence of thermal expansion is directed toward the gap proximal end side, which is the opposite side to the gap side (slider surface).
なお、上記実施例では、保：ｉ膜をヘッド最上の結合部
からギャップ先端側に成膜するようにしたが、導体コイ
ルの積層数や有機絶縁材の種類等で熱膨張も変化するの
で、保護膜の成膜範囲もこれに応じて変える等適宜変更
すれば良（、一部分であれば良い。In the above example, the protective film was formed from the topmost joint of the head to the tip of the gap, but since thermal expansion varies depending on the number of laminated conductor coils, the type of organic insulating material, etc. The area in which the protective film is formed may be changed as appropriate, such as changing the area in which the protective film is formed (as long as it is only a portion).
以上、一実施例とともに具体的に説明したように、この
発明によれば、薄膜磁気ヘッドを覆うよう設けられる保
護膜をヘッド最上のギャップ先端側の一部にだけ積層す
るようにしたので、導体コイルの発熱による層間絶縁用
の有機絶縁材の熱膨張を保護膜のない部分に逃がすこと
ができ、上部磁性層のギャップ側（スライド面）への突
き出しを防止することができる。As described above in detail along with one embodiment, according to the present invention, the protective film provided to cover the thin-film magnetic head is laminated only on a part of the gap tip side at the top of the head. Thermal expansion of the organic insulating material for interlayer insulation due to heat generated by the coil can be released to a portion without a protective film, and it is possible to prevent the upper magnetic layer from protruding toward the gap side (sliding surface).
したがって、薄膜磁気ヘッドを低浮上状態で使用する場
合にも、スペーシング変動にともなう書込み損失の変化
や磁気ディスク等磁気記録媒体の損傷や破壊等の事故を
防止することができる。Therefore, even when the thin film magnetic head is used in a low flying state, it is possible to prevent accidents such as changes in write loss due to variations in spacing and damage or destruction of magnetic recording media such as magnetic disks.
また、保護膜の積層はハードマスクの使用により簡単に
出来、製造コス１−も安１Ｉｌｌｉ′Ｃ−ある。Further, the protective film can be laminated easily by using a hard mask, and the manufacturing cost is low.
第１図〜第３図はこの発明の辞膜磁気ヘッドの保護膜の
構造の一実施例にかかり、第１図は斜視図、第２図は平
面図、第３図は断面図、第４図および第５図はこの発明
の保１膜の構造を成膜する工程にかかる平面図および部
分断面図、第６図は従来の保護膜の製造工程図である。
１０・・・薄膜磁気ヘッド、１１・・・保護膜、１２・
・・ハードマスク、１・・・非磁性基板、２・・・下部
磁性層、３・・・非磁性体（ギャップ）、４・・・有機
絶縁材、５・・・導体コイル、６・・・上部磁性層。1 to 3 show one embodiment of the structure of the protective film of the film magnetic head of the present invention, in which FIG. 1 is a perspective view, FIG. 2 is a plan view, FIG. 3 is a sectional view, and FIG. 5 and 5 are plan views and partial cross-sectional views of the process of forming the structure of the protective film of the present invention, and FIG. 6 is a diagram showing the manufacturing process of a conventional protective film. 10... Thin film magnetic head, 11... Protective film, 12.
... Hard mask, 1... Nonmagnetic substrate, 2... Lower magnetic layer, 3... Nonmagnetic material (gap), 4... Organic insulating material, 5... Conductor coil, 6...・Top magnetic layer.
Claims (1)
護する保護膜において、導体コイルの層間に設けられる
有機絶縁材の熱膨張をギャップ基端側に逃がすよう薄膜
磁気ヘッドの最上層のギャップ先端側の一部に保護膜を
設けたことを特徴とする薄膜磁気ヘッドの保護膜の構造
。In a protective film that protects a thin-film magnetic head that is formed by laminating films on a substrate, a gap is formed in the top layer of the thin-film magnetic head so that thermal expansion of an organic insulating material provided between layers of a conductor coil escapes to the base end of the gap. A structure of a protective film of a thin-film magnetic head, characterized in that a protective film is provided on a part of the tip side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25343986A JPS63108516A (en) | 1986-10-24 | 1986-10-24 | Structure of protecting film for thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25343986A JPS63108516A (en) | 1986-10-24 | 1986-10-24 | Structure of protecting film for thin film magnetic head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63108516A true JPS63108516A (en) | 1988-05-13 |
Family
ID=17251416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25343986A Pending JPS63108516A (en) | 1986-10-24 | 1986-10-24 | Structure of protecting film for thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63108516A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4924967A (en) * | 1988-03-29 | 1990-05-15 | Nissan Motor Company, Ltd. | Exhaust manifold |
| US6914750B2 (en) * | 2001-10-05 | 2005-07-05 | Headway Technologies, Inc. | Thermal protrusion reduction in magnet heads by utilizing heat sink layers |
| EP1583077A2 (en) * | 2004-03-30 | 2005-10-05 | Fujitsu Limited | Magnetic head structure with enlarged insulating layer |
| EP1705646A1 (en) * | 2005-03-23 | 2006-09-27 | Fujitsu Limited | Magnetic head structure |
-
1986
- 1986-10-24 JP JP25343986A patent/JPS63108516A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4924967A (en) * | 1988-03-29 | 1990-05-15 | Nissan Motor Company, Ltd. | Exhaust manifold |
| US6914750B2 (en) * | 2001-10-05 | 2005-07-05 | Headway Technologies, Inc. | Thermal protrusion reduction in magnet heads by utilizing heat sink layers |
| EP1583077A2 (en) * | 2004-03-30 | 2005-10-05 | Fujitsu Limited | Magnetic head structure with enlarged insulating layer |
| EP1583077A3 (en) * | 2004-03-30 | 2007-07-25 | Fujitsu Limited | Magnetic head structure with enlarged insulating layer |
| US7414810B2 (en) | 2004-03-30 | 2008-08-19 | Fujitsu Limited | Magnetic head structure with insulating layer configured to reduce thermal deformation of floating surface towards disk |
| EP1705646A1 (en) * | 2005-03-23 | 2006-09-27 | Fujitsu Limited | Magnetic head structure |
| US7382579B2 (en) | 2005-03-23 | 2008-06-03 | Fujitsu Limited | Magnetic head structure |
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