JPS63107561U - - Google Patents
Info
- Publication number
- JPS63107561U JPS63107561U JP16169686U JP16169686U JPS63107561U JP S63107561 U JPS63107561 U JP S63107561U JP 16169686 U JP16169686 U JP 16169686U JP 16169686 U JP16169686 U JP 16169686U JP S63107561 U JPS63107561 U JP S63107561U
- Authority
- JP
- Japan
- Prior art keywords
- showing
- chip
- view
- grinding wheel
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010953 base metal Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
第１図は本考案の実施例を示し、イ図は一部上
面図、ロ図は断面図を示す。第２図は本考案にお
いて取付けられるメタルボンドダイヤモンド砥粒
チツプを示し、イ図は上面、ロ図は側面を示す。
第３図は本考案の他の実施例を一部上面図で示す
。第４図は従来から用いられているカツプ形ダイ
ヤモンド砥粒砥石を示し、イ図は一部上面図、ロ
図は断面図を示す。
１…カツプ形台金、１′…デイスク、２…カツ
プ形台金の端面、３…チツプ、４…チツプの角部
、５…チツプのベース層、６…メタルボンドされ
たダイヤモンド砥粒層、７…丸みを付けたチツプ
の角部、８…回転軸取付部。
Fig. 1 shows an embodiment of the present invention, with Fig. A showing a partial top view and Fig. B showing a sectional view. Fig. 2 shows the metal bond diamond abrasive grain chip attached in the present invention, with Fig. A showing the top side and Fig. B showing the side view.
FIG. 3 shows another embodiment of the invention in partial top view. FIG. 4 shows a conventionally used cup-shaped diamond abrasive grinding wheel, with FIG. 4 showing a partial top view and FIG. 4 showing a sectional view. DESCRIPTION OF SYMBOLS 1... Cup-shaped base metal, 1'... Disk, 2... End surface of cup-shaped base metal, 3... Chip, 4... Corner part of chip, 5... Base layer of chip, 6... Metal-bonded diamond abrasive grain layer, 7... Rounded corner of the chip, 8... Rotating shaft mounting part.
Claims (1)
みを形成した超砥粒メタルボンドチツプを複数個
台金上に配列して接合したことを特徴とする研削
砥石。 A grinding wheel characterized in that a plurality of super-abrasive metal bond chips each having a radius of 1 mm to 5 mm rounded at least on the inner corner are arranged and bonded on a base metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16169686U JPS63107561U (en) | 1986-10-21 | 1986-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16169686U JPS63107561U (en) | 1986-10-21 | 1986-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63107561U true JPS63107561U (en) | 1988-07-11 |
Family
ID=31088250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16169686U Pending JPS63107561U (en) | 1986-10-21 | 1986-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63107561U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5231510U (en) * | 1975-08-25 | 1977-03-05 |
-
1986
- 1986-10-21 JP JP16169686U patent/JPS63107561U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5231510U (en) * | 1975-08-25 | 1977-03-05 |
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