JPS63106619U - - Google Patents
Info
- Publication number
- JPS63106619U JPS63106619U JP20073586U JP20073586U JPS63106619U JP S63106619 U JPS63106619 U JP S63106619U JP 20073586 U JP20073586 U JP 20073586U JP 20073586 U JP20073586 U JP 20073586U JP S63106619 U JPS63106619 U JP S63106619U
- Authority
- JP
- Japan
- Prior art keywords
- gate
- mold
- temperature
- cooling medium
- adjustment device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 2
- 239000002826 coolant Substances 0.000 claims 2
- 238000002347 injection Methods 0.000 claims 2
- 239000007924 injection Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20073586U JPS63106619U (enExample) | 1986-12-27 | 1986-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20073586U JPS63106619U (enExample) | 1986-12-27 | 1986-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63106619U true JPS63106619U (enExample) | 1988-07-09 |
Family
ID=31163527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20073586U Pending JPS63106619U (enExample) | 1986-12-27 | 1986-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63106619U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020011488A (ja) * | 2018-07-20 | 2020-01-23 | セイコーエプソン株式会社 | 射出成形装置および射出成形方法 |
-
1986
- 1986-12-27 JP JP20073586U patent/JPS63106619U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020011488A (ja) * | 2018-07-20 | 2020-01-23 | セイコーエプソン株式会社 | 射出成形装置および射出成形方法 |