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Filing date
Publication date
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Priority to JP20008086UpriorityCriticalpatent/JPS63106132U/ja
Publication of JPS63106132UpublicationCriticalpatent/JPS63106132U/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
H01L24/743—Apparatus for manufacturing layer connectors
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
H01L2224/743—Apparatus for manufacturing layer connectors
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Engineering & Computer Science
(AREA)
Manufacturing & Machinery
(AREA)
Computer Hardware Design
(AREA)
Microelectronics & Electronic Packaging
(AREA)
Power Engineering
(AREA)
Electric Connection Of Electric Components To Printed Circuits
(AREA)
