JPS63105332U - - Google Patents
Info
- Publication number
- JPS63105332U JPS63105332U JP20409786U JP20409786U JPS63105332U JP S63105332 U JPS63105332 U JP S63105332U JP 20409786 U JP20409786 U JP 20409786U JP 20409786 U JP20409786 U JP 20409786U JP S63105332 U JPS63105332 U JP S63105332U
- Authority
- JP
- Japan
- Prior art keywords
- stem
- semiconductor
- chip
- pedestal
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Pressure Sensors (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20409786U JPS63105332U (US07709020-20100504-C00041.png) | 1986-12-24 | 1986-12-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20409786U JPS63105332U (US07709020-20100504-C00041.png) | 1986-12-24 | 1986-12-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63105332U true JPS63105332U (US07709020-20100504-C00041.png) | 1988-07-08 |
Family
ID=31170036
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20409786U Pending JPS63105332U (US07709020-20100504-C00041.png) | 1986-12-24 | 1986-12-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63105332U (US07709020-20100504-C00041.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110098213A (zh) * | 2019-05-15 | 2019-08-06 | 德淮半导体有限公司 | 一种芯片模组封装定位方法 |
-
1986
- 1986-12-24 JP JP20409786U patent/JPS63105332U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110098213A (zh) * | 2019-05-15 | 2019-08-06 | 德淮半导体有限公司 | 一种芯片模组封装定位方法 |