JPS63102143U - - Google Patents
Info
- Publication number
- JPS63102143U JPS63102143U JP19781786U JP19781786U JPS63102143U JP S63102143 U JPS63102143 U JP S63102143U JP 19781786 U JP19781786 U JP 19781786U JP 19781786 U JP19781786 U JP 19781786U JP S63102143 U JPS63102143 U JP S63102143U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation fin
- power transistor
- safety device
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 4
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Protection Of Static Devices (AREA)
- Fuses (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案に係るパワートランジスタの
安全装置の実施例を示す正面図、第２図は同上の
安全装置の分解斜視図、第３図は同上のパワート
ランジスタの安全装置を用いる自動車用空調装置
におけるブロア制御回路を示す回路図である。
５……放熱フイン、７……ばね、１１……低融
点材料。
Fig. 1 is a front view showing an embodiment of the power transistor safety device according to this invention, Fig. 2 is an exploded perspective view of the same safety device, and Fig. 3 is an air conditioner for an automobile using the same power transistor safety device. FIG. 3 is a circuit diagram showing a blower control circuit in the device. 5... Heat radiation fin, 7... Spring, 11... Low melting point material.
Claims (1)
この放熱フインが低融点材料をもつて接合された
配線基板との間に、前記放熱フインを前記配線基
板から離す方向へ付勢する弾性手段を介在したこ
とを特徴とするパワートランジスタの安全装置。 ２ 弾性手段は形状記憶合金を含むことを特徴と
する実用新案登録請求の範囲第１項記載のパワー
トランジスタの安全装置。[Claims for Utility Model Registration] 1. A heat dissipation fin provided with a power transistor,
A safety device for a power transistor, characterized in that elastic means is interposed between the heat dissipation fin and a wiring board to which the heat dissipation fin is bonded using a low-melting point material in a direction that urges the heat dissipation fin away from the wiring board. 2. The safety device for a power transistor according to claim 1, wherein the elastic means includes a shape memory alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19781786U JPS63102143U (en) | 1986-12-23 | 1986-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19781786U JPS63102143U (en) | 1986-12-23 | 1986-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63102143U true JPS63102143U (en) | 1988-07-02 |
Family
ID=31157929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19781786U Pending JPS63102143U (en) | 1986-12-23 | 1986-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63102143U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0271594A (en) * | 1988-03-22 | 1990-03-12 | Bull Sa | Device for fixing two parts with each othrer by pressure |
-
1986
- 1986-12-23 JP JP19781786U patent/JPS63102143U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0271594A (en) * | 1988-03-22 | 1990-03-12 | Bull Sa | Device for fixing two parts with each othrer by pressure |
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