JPS63100834U - - Google Patents
Info
- Publication number
- JPS63100834U JPS63100834U JP1986195655U JP19565586U JPS63100834U JP S63100834 U JPS63100834 U JP S63100834U JP 1986195655 U JP1986195655 U JP 1986195655U JP 19565586 U JP19565586 U JP 19565586U JP S63100834 U JPS63100834 U JP S63100834U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- lead
- preheating
- gigantic
- film carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986195655U JPH056660Y2 (US20100223739A1-20100909-C00025.png) | 1986-12-19 | 1986-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986195655U JPH056660Y2 (US20100223739A1-20100909-C00025.png) | 1986-12-19 | 1986-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63100834U true JPS63100834U (US20100223739A1-20100909-C00025.png) | 1988-06-30 |
| JPH056660Y2 JPH056660Y2 (US20100223739A1-20100909-C00025.png) | 1993-02-19 |
Family
ID=31153738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986195655U Expired - Lifetime JPH056660Y2 (US20100223739A1-20100909-C00025.png) | 1986-12-19 | 1986-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH056660Y2 (US20100223739A1-20100909-C00025.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02205334A (ja) * | 1989-02-03 | 1990-08-15 | Orient Watch Co Ltd | 半導体装置の製造方法 |
-
1986
- 1986-12-19 JP JP1986195655U patent/JPH056660Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02205334A (ja) * | 1989-02-03 | 1990-08-15 | Orient Watch Co Ltd | 半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH056660Y2 (US20100223739A1-20100909-C00025.png) | 1993-02-19 |
