JPS6298253U - - Google Patents
Info
- Publication number
- JPS6298253U JPS6298253U JP18967885U JP18967885U JPS6298253U JP S6298253 U JPS6298253 U JP S6298253U JP 18967885 U JP18967885 U JP 18967885U JP 18967885 U JP18967885 U JP 18967885U JP S6298253 U JPS6298253 U JP S6298253U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductive filler
- insulating substrate
- circuit board
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011231 conductive filler Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18967885U JPH0537492Y2 (US20020051482A1-20020502-M00012.png) | 1985-12-11 | 1985-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18967885U JPH0537492Y2 (US20020051482A1-20020502-M00012.png) | 1985-12-11 | 1985-12-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6298253U true JPS6298253U (US20020051482A1-20020502-M00012.png) | 1987-06-23 |
| JPH0537492Y2 JPH0537492Y2 (US20020051482A1-20020502-M00012.png) | 1993-09-22 |
Family
ID=31142198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18967885U Expired - Lifetime JPH0537492Y2 (US20020051482A1-20020502-M00012.png) | 1985-12-11 | 1985-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537492Y2 (US20020051482A1-20020502-M00012.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4427994C2 (de) * | 1993-08-06 | 2000-10-26 | Mitsubishi Electric Corp | Metallkernsubstrat, insbesondere zur Verwendung für elektronische Schaltungen |
-
1985
- 1985-12-11 JP JP18967885U patent/JPH0537492Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4427994C2 (de) * | 1993-08-06 | 2000-10-26 | Mitsubishi Electric Corp | Metallkernsubstrat, insbesondere zur Verwendung für elektronische Schaltungen |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0537492Y2 (US20020051482A1-20020502-M00012.png) | 1993-09-22 |
