JPS6297723U - - Google Patents
Info
- Publication number
- JPS6297723U JPS6297723U JP18933885U JP18933885U JPS6297723U JP S6297723 U JPS6297723 U JP S6297723U JP 18933885 U JP18933885 U JP 18933885U JP 18933885 U JP18933885 U JP 18933885U JP S6297723 U JPS6297723 U JP S6297723U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- medium
- heat exchange
- exchange tank
- pump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
第1図は本考案の一実施例を示す金型温度調節
機の金型接続を含む配管図、第2図は第1図の通
常運転時のA部の拡大断面図、第3図は第1図の
金型から媒体を排出するときのE部の拡大断面図
、第4図は本考案の一実施例を示す金型温度調節
機本体の断面斜視図、第5図は第1図に相当する
従来例の金型接続を含む配管図である。
22……金型温度調節機本体、23……媒体、
24……熱交換タンク、25……媒体出口管、2
6……媒体入口管、27,28……金型、29…
…ポンプ、30,31,32,33……自在ホー
ス、34,35,36,37……三方弁。
Fig. 1 is a piping diagram including mold connections of a mold temperature controller showing an embodiment of the present invention, Fig. 2 is an enlarged sectional view of section A in Fig. 1 during normal operation, and Fig. 3 is a Fig. 1 is an enlarged sectional view of part E when discharging the medium from the mold, Fig. 4 is a sectional perspective view of the mold temperature controller body showing an embodiment of the present invention, and Fig. 5 is the same as Fig. 1. It is a piping diagram including a mold connection of a corresponding conventional example. 22... Mold temperature controller body, 23... Medium,
24... Heat exchange tank, 25... Medium outlet pipe, 2
6...Medium inlet pipe, 27, 28...Mold, 29...
... Pump, 30, 31, 32, 33... Flexible hose, 34, 35, 36, 37... Three-way valve.
Claims (1)
ンクと連結される金型と、前記媒体を金型に循環
させるポンプと、前記熱交換タンクと金型の間に
介在され、前記金型に媒体を流す位置と、ガスを
強制的に流す位置とに切替る弁とを備えた金型温
度調節機。 A heat exchange tank containing a medium, a mold connected to the heat exchange tank, a pump that circulates the medium to the mold, and a pump interposed between the heat exchange tank and the mold to supply the medium to the mold. A mold temperature controller equipped with a valve that switches between a position where the gas flows and a position where the gas is forced to flow.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18933885U JPS6297723U (en) | 1985-12-09 | 1985-12-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18933885U JPS6297723U (en) | 1985-12-09 | 1985-12-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6297723U true JPS6297723U (en) | 1987-06-22 |
Family
ID=31141544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18933885U Pending JPS6297723U (en) | 1985-12-09 | 1985-12-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6297723U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6432114U (en) * | 1987-08-19 | 1989-02-28 | ||
JPH0413319U (en) * | 1990-05-24 | 1992-02-03 | ||
JP2010083122A (en) * | 2008-09-30 | 2010-04-15 | Mitac Precision Technology (Kunshan) Corp | High-speed injection molding system |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3565986A (en) * | 1967-04-03 | 1971-02-23 | Goodyear Tire & Rubber | Method of heating electroform molds |
-
1985
- 1985-12-09 JP JP18933885U patent/JPS6297723U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3565986A (en) * | 1967-04-03 | 1971-02-23 | Goodyear Tire & Rubber | Method of heating electroform molds |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6432114U (en) * | 1987-08-19 | 1989-02-28 | ||
JPH0413319U (en) * | 1990-05-24 | 1992-02-03 | ||
JP2010083122A (en) * | 2008-09-30 | 2010-04-15 | Mitac Precision Technology (Kunshan) Corp | High-speed injection molding system |
JP4653208B2 (en) * | 2008-09-30 | 2011-03-16 | 漢達精密電子(昆山)有限公司 | High speed injection molding system |