JPS629746Y2 - - Google Patents

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Publication number
JPS629746Y2
JPS629746Y2 JP1981136501U JP13650181U JPS629746Y2 JP S629746 Y2 JPS629746 Y2 JP S629746Y2 JP 1981136501 U JP1981136501 U JP 1981136501U JP 13650181 U JP13650181 U JP 13650181U JP S629746 Y2 JPS629746 Y2 JP S629746Y2
Authority
JP
Japan
Prior art keywords
semiconductor component
optical semiconductor
optical fiber
light
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981136501U
Other languages
Japanese (ja)
Other versions
JPS5840849U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13650181U priority Critical patent/JPS5840849U/en
Publication of JPS5840849U publication Critical patent/JPS5840849U/en
Application granted granted Critical
Publication of JPS629746Y2 publication Critical patent/JPS629746Y2/ja
Granted legal-status Critical Current

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  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Description

【考案の詳細な説明】 本考案は光フアイバケーブルと光半導体部品の
結合構造に関する。
[Detailed Description of the Invention] The present invention relates to a coupling structure between an optical fiber cable and an optical semiconductor component.

光信号と電気信号間の変換のため、光半導体部
品の受光又は発光素子と光フアイバとの結合を要
し、更に着脱交換のため光フアイバコネクタに類
似する結合構造を要する。
To convert between optical and electrical signals, a light receiving or emitting element of an optical semiconductor component must be coupled to an optical fiber, and a coupling structure similar to an optical fiber connector is required for attachment, detachment, and replacement.

第1図は従来の光フアイバケーブルと光半導体
部品の結合構造を示す断面図である。図は結合前
の姿勢を示し、左側は光フアイバケーブルの保持
構造を示す。光フアイバケーブル1は保持体2の
中に固定され、光フアイバ3は保持体2の軸芯孔
2aに固着され、保持体2の端面2bと面を同じ
くして研磨加工され平滑に仕上げられている。図
右側の結合体4は保持体2と嵌合する貫通孔4a
が設けられているため、対向する光半導体部品5
の軸芯と保持体2の軸芯を一致させることが出来
る。保持体2は袋状ナツト6のねじを結合体4の
ねじ4bと結合し固定される。光半導体部品5は
結合体4の貫通孔端面4cに外面をおしつけ間隔
リング7を介してねじ8により固定される。
FIG. 1 is a sectional view showing a conventional coupling structure between an optical fiber cable and an optical semiconductor component. The figure shows the posture before connection, and the left side shows the holding structure for the optical fiber cable. The optical fiber cable 1 is fixed in the holder 2, and the optical fiber 3 is fixed in the axial hole 2a of the holder 2, and is polished to be smooth and flush with the end surface 2b of the holder 2. There is. The combination body 4 on the right side of the figure has a through hole 4a that fits into the holding body 2.
is provided, so that the opposing optical semiconductor component 5
The axis of the holding body 2 can be made to coincide with the axis of the holding body 2. The holder 2 is fixed by connecting the screw of the bag nut 6 with the screw 4b of the coupling body 4. The optical semiconductor component 5 has its outer surface pressed onto the through-hole end surface 4c of the combination body 4 and is fixed with a screw 8 via a spacing ring 7.

前述の構造において光フアイバ側の保持体2の
端面2bと光半導体部品5の受光又は発光面は極
力近接させることにより効率のよい変換が得られ
るため、この間隙は最小に設計される。一方光半
導体部品の表面は内部素子の保護と透光性を与え
るため約0.1mmの厚さのサフアイヤの透光板9が
設けられているがその外径は受光又は発光素子の
内部電極配線等の構造要因から制約され、十分に
小さく出来ない事情がある。この透光板9に保持
体2が接近しているため、保持体2と結合体4の
組合せによる寸法誤差、又透光板9に異物が付着
した場合、結合により薄い透光板9が割れ、破壊
される。特に外部より結合部を見ることが出来な
いため、損傷に気付かぬ場合を生ずる。本考案は
前述の事故防止の対策である。即ち光フアイバケ
ーブル1を固着する保持体2と光半導体部品5を
収容する結合体4とが、着脱交換可能な如く機械
的結合されて、光フアイバと光半導体部品の受光
又は発光素子との光結合が行われる構造におい
て、結合体4の貫通孔4aに嵌合される保持体2
の端面2bは、その軸芯孔2aに固着される光フ
アイバ3の先端面と同一面を有し、かつこの端面
2bは結合体4の貫通孔凹部端面4cにはめこま
れた保護リング10の小孔10a及び受光又は発
光素子11を保護する透光性の透光板9を介し
て、光半導体部品5の受光又は発光素子と光結合
されることを特徴とする光半導体部品結合構造に
より光半導体部品の保護を完全に行うことが出来
る。
In the above-described structure, efficient conversion can be achieved by bringing the end surface 2b of the optical fiber-side holder 2 and the light-receiving or emitting surface of the optical semiconductor component 5 as close as possible, so this gap is designed to be minimal. On the other hand, the surface of the optical semiconductor component is provided with a transparent plate 9 made of sapphire with a thickness of about 0.1 mm in order to protect the internal elements and provide light transmission. There are circumstances in which it cannot be made sufficiently small due to constraints from structural factors. Since the holder 2 is close to the transparent plate 9, if there is a dimensional error due to the combination of the holder 2 and the combined body 4, or if foreign matter adheres to the transparent plate 9, the thin transparent plate 9 may break due to the combination. , destroyed. In particular, since the joint cannot be seen from the outside, damage may go unnoticed. This invention is a measure to prevent the aforementioned accident. That is, the holder 2 that fixes the optical fiber cable 1 and the combination body 4 that houses the optical semiconductor component 5 are mechanically connected to each other so that they can be detached and replaced, so that light can be transmitted between the optical fiber and the optical semiconductor component or the light emitting element. In the structure in which the bonding is performed, the holder 2 is fitted into the through hole 4a of the bonding body 4.
The end surface 2b of the protective ring 10 has the same surface as the tip surface of the optical fiber 3 fixed to the axial center hole 2a, and the end surface 2b of the protective ring 10 fitted in the end surface 4c of the through-hole recess of the combined body 4 The optical semiconductor component coupling structure is characterized in that it is optically coupled to the light receiving or emitting element of the optical semiconductor component 5 through the small hole 10a and the light transmitting plate 9 that protects the light receiving or emitting element 11. Semiconductor components can be completely protected.

以下本考案による実施例について詳細説明す
る。尚第1図より第3図迄図中同一符号は同一物
を示す。
Examples according to the present invention will be described in detail below. Note that the same reference numerals in the figures from FIG. 1 to FIG. 3 indicate the same parts.

第2図は本考案に係る保護リングを装着した光
半導体部品の結合を示す断面図である。保護リン
グ10は円板状で光半導体部品5の外径Aとほぼ
同一径を有し、結合体4の貫通孔凹部端面4cに
はめこまれて光半導体部品5が挿入されてあり、
その背後の間隔リング7を介しねじ8をもつて押
圧固定されている。
FIG. 2 is a sectional view showing the connection of optical semiconductor components equipped with a protection ring according to the present invention. The protective ring 10 is disk-shaped and has approximately the same diameter as the outer diameter A of the optical semiconductor component 5, and is fitted into the end surface 4c of the through hole recess of the combined body 4, into which the optical semiconductor component 5 is inserted.
It is pressed and fixed with a screw 8 through a spacing ring 7 behind it.

保護リング10の中心部には小孔10aを有
し、光フアイバより投射される光を妨げることな
く、又保持体2の外径Bに比し、小孔10aの直
径は著るしく小さい。
The protective ring 10 has a small hole 10a in its center, which does not interfere with the light projected from the optical fiber, and the diameter of the small hole 10a is significantly smaller than the outer diameter B of the holder 2.

保持体2は結合体4の貫通孔4aに挿入される
とフランジ部2cの端面が結合体の端面4dにつ
き当る。この場合に保持体2の端面2bは貫通孔
4aより突き出すことがないよう設計上の寸法が
定められている。従つて設計上端面2bは図面上
では保護リング10に接触することはない。しか
し端面2bと保護リング10により構成される微
少な間隙eは保持体2と結合体4の幾可的寸法誤
差より変化し、著るしく狭少になる場合が生ず
る。又形状的な誤差、変形等によつても影響を受
ける。
When the holder 2 is inserted into the through hole 4a of the combined body 4, the end surface of the flange portion 2c comes into contact with the end surface 4d of the combined body. In this case, the design dimensions are determined so that the end surface 2b of the holder 2 does not protrude beyond the through hole 4a. Therefore, the designed upper end surface 2b does not come into contact with the protective ring 10 in the drawing. However, the minute gap e formed between the end surface 2b and the protective ring 10 changes due to geometric dimensional errors between the holder 2 and the combined body 4, and may become extremely narrow. It is also affected by shape errors, deformations, etc.

第3図は保持体、結合体の形状誤差を示す断面
図である。一例として保持体2のフランジ部2c
の端面および結合体4の端面4dが夫々の軸芯に
対する直角度に誤差γを有する場合においては間
隙eは狭められる。加えて微小な打痕突起、異物
の付着などが重なると貫通孔4aより僅かに突出
する場合が生ずる。
FIG. 3 is a sectional view showing shape errors of the holding body and the combined body. As an example, the flange portion 2c of the holding body 2
The gap e is narrowed when the end face of the end face and the end face 4d of the combined body 4 have an error γ in the perpendicularity to their respective axes. In addition, if minute protrusions, foreign matter, etc. are overlapped, it may protrude slightly from the through hole 4a.

本考案においては保持体2の突出による圧力を
直接光半導体部品5のサフアイヤの透光板9に与
えることはなく保護リング10がその圧力を支え
ることになる。
In the present invention, the pressure due to the protrusion of the holder 2 is not directly applied to the sapphire transparent plate 9 of the optical semiconductor component 5, but the protection ring 10 supports the pressure.

尚前述の事例が生ずる場合結合体4に保護リン
グ10を一体と製作する事が想定されるが、貫通
孔4aを精密に仕上げることが著るしく困難な問
題となる。
If the above-mentioned case occurs, it is assumed that the protective ring 10 is manufactured integrally with the combined body 4, but it becomes extremely difficult to precisely finish the through hole 4a.

第4図は第2図のC部の詳細を示す構成図であ
る。保護リング10の厚みは実施例において約
0.2mmであるため、当然光フアイバの端面は光半
導体部品5の受光又は発光素子11からこの分だ
け遠ざかることになる。しかし、光フアイバ端面
における放射角θ内に受光又は発光素子の有効面
が納るようにしてこの結合損失はさけることが出
来る。実施例ではθは約30゜で保護リング10の
厚みには適正値が得られた。尚第1図における間
隔リング7、およびねじ8は保護リング10の挿
入によつても充分機能する。尚保護リング10の
中心部の孔10a周辺および両面部はかえりなく
平滑に仕上られており、光フアイバ端面および光
半導体部品5の透光板9に損傷を与えることがな
いよう注意が払われている。尚保護リング10の
材料には18−8ステンレス材を実施例で用いた
が、他の金属又は非金属材を用いることについて
特に拘束はない。
FIG. 4 is a configuration diagram showing details of section C in FIG. 2. In the embodiment, the thickness of the protective ring 10 is approximately
Since it is 0.2 mm, the end face of the optical fiber will naturally be distanced from the light receiving or light emitting element 11 of the optical semiconductor component 5 by this distance. However, this coupling loss can be avoided by making the effective surface of the light-receiving or light-emitting element fall within the radiation angle θ at the end face of the optical fiber. In the example, θ was approximately 30°, and an appropriate thickness of the protective ring 10 was obtained. Note that the spacing ring 7 and screw 8 in FIG. 1 function satisfactorily even when a protective ring 10 is inserted. The area around the hole 10a in the center of the protective ring 10 and both sides are finished to be smooth, and care is taken not to damage the end face of the optical fiber and the transparent plate 9 of the optical semiconductor component 5. There is. Although 18-8 stainless steel is used as the material for the protective ring 10 in the embodiment, there is no particular restriction on the use of other metals or non-metallic materials.

以上本考案によれば、光半導体部品の透光板は
破損することが防止され、この結合に対して熟練
を要することがなく特性の保証と信頼性が高めら
れる。
As described above, according to the present invention, the transparent plate of the optical semiconductor component is prevented from being damaged, no skill is required for this connection, and the characteristics are guaranteed and the reliability is improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の光フアイバケーブルと受光又は
発光素子の結合構造を示す断面図、第2図は本考
案に係る保護リングを装着した光半導体部品の結
合を示す断面図、第3図は保持体、結合体の形状
誤差を示す断面図、第4図は第2図の受光又は発
光部の詳細を示す構成図である。 図において、1は光フアイバケーブル、2は保
持体、3は光フアイバ、4は結合体、5は光半導
体部品、9は透光板、10は保護リング、11は
受光又は発光素子を示す。
Fig. 1 is a sectional view showing a conventional coupling structure between an optical fiber cable and a light receiving or emitting element, Fig. 2 is a sectional view showing a coupling of an optical semiconductor component equipped with a protective ring according to the present invention, and Fig. 3 is a holding structure. FIG. 4 is a cross-sectional view showing shape errors of the body and the combined body, and FIG. 4 is a configuration diagram showing details of the light receiving or emitting part of FIG. 2. In the figure, 1 is an optical fiber cable, 2 is a holder, 3 is an optical fiber, 4 is a combination body, 5 is an optical semiconductor component, 9 is a transparent plate, 10 is a protection ring, and 11 is a light receiving or light emitting element.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 光フアイバケーブル1を固着する保持体2と光
半導体部品5を収容する結合体4とが、着脱交換
可能な如く機械的結合されて、光フアイバと光半
導体部品の受光又は発光素子との光結合が行われ
る構造において、結合体4の貫通孔4aに嵌合さ
れる保持体2の端面2bは、その軸芯孔2aに固
着される光フアイバ3の先端面と同一面を有し、
かつこの端面2bは結合体4の貫通孔凹部端面4
cにはめこまれた保護リング10の小孔10a及
び透光性の透光板9を介して、光半導体部品5の
受光又は発光素子と光結合されることを特徴とす
る光半導体部品結合構造。
The holder 2 that fixes the optical fiber cable 1 and the coupling body 4 that accommodates the optical semiconductor component 5 are mechanically coupled so as to be detachable and replaceable, thereby optically coupling the optical fiber and the light-receiving or light-emitting element of the optical semiconductor component. In the structure in which this is carried out, the end surface 2b of the holder 2 fitted into the through hole 4a of the coupling body 4 has the same surface as the tip surface of the optical fiber 3 fixed to the axial center hole 2a,
And this end surface 2b is the end surface 4 of the through hole recess of the combined body 4.
An optical semiconductor component coupling structure characterized in that the optical semiconductor component 5 is optically coupled to the light receiving or light emitting element of the optical semiconductor component 5 through the small hole 10a of the protective ring 10 fitted in the protective ring 10 and the light transmitting plate 9. .
JP13650181U 1981-09-14 1981-09-14 Optical semiconductor component coupling structure Granted JPS5840849U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13650181U JPS5840849U (en) 1981-09-14 1981-09-14 Optical semiconductor component coupling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13650181U JPS5840849U (en) 1981-09-14 1981-09-14 Optical semiconductor component coupling structure

Publications (2)

Publication Number Publication Date
JPS5840849U JPS5840849U (en) 1983-03-17
JPS629746Y2 true JPS629746Y2 (en) 1987-03-06

Family

ID=29929826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13650181U Granted JPS5840849U (en) 1981-09-14 1981-09-14 Optical semiconductor component coupling structure

Country Status (1)

Country Link
JP (1) JPS5840849U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55107275A (en) * 1979-02-09 1980-08-16 Fujitsu Ltd Photosemiconductor package

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54177878U (en) * 1978-06-05 1979-12-15

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55107275A (en) * 1979-02-09 1980-08-16 Fujitsu Ltd Photosemiconductor package

Also Published As

Publication number Publication date
JPS5840849U (en) 1983-03-17

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