JPS6296900U - - Google Patents
Info
- Publication number
- JPS6296900U JPS6296900U JP1985189196U JP18919685U JPS6296900U JP S6296900 U JPS6296900 U JP S6296900U JP 1985189196 U JP1985189196 U JP 1985189196U JP 18919685 U JP18919685 U JP 18919685U JP S6296900 U JPS6296900 U JP S6296900U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- case member
- integrated circuit
- hybrid integrated
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Combinations Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985189196U JPS6296900U (enExample) | 1985-12-09 | 1985-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985189196U JPS6296900U (enExample) | 1985-12-09 | 1985-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6296900U true JPS6296900U (enExample) | 1987-06-20 |
Family
ID=31141271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985189196U Pending JPS6296900U (enExample) | 1985-12-09 | 1985-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6296900U (enExample) |
-
1985
- 1985-12-09 JP JP1985189196U patent/JPS6296900U/ja active Pending