JPS6296880U - - Google Patents

Info

Publication number

JPS6296880U

JPS6296880U JP18726385U JP18726385U JPS6296880U JP S6296880 U JPS6296880 U JP S6296880U JP 18726385 U JP18726385 U JP 18726385U JP 18726385 U JP18726385 U JP 18726385U JP S6296880 U JPS6296880 U JP S6296880U

Authority

JP

Japan

Prior art keywords

component mounting

mounting surface

wiring board

printed wiring

foil pattern

Prior art date

1985-12-06

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
• 239000011248 coating agent Substances 0.000 claims description 4
• 238000000576 coating method Methods 0.000 claims description 4
• 239000011889 copper foil Substances 0.000 claims description 4
• 239000011888 foil Substances 0.000 claims 1
• 239000000463 material Substances 0.000 description 1
• 238000007747 plating Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1