JPS6296876U - - Google Patents

Info

Publication number

JPS6296876U

JPS6296876U JP1985188577U JP18857785U JPS6296876U JP S6296876 U JPS6296876 U JP S6296876U JP 1985188577 U JP1985188577 U JP 1985188577U JP 18857785 U JP18857785 U JP 18857785U JP S6296876 U JPS6296876 U JP S6296876U

Authority

JP

Japan

Prior art keywords

component mounting

circuit board

printed circuit

land

pattern connection

Prior art date

1985-12-06

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
• 229910052802 copper Inorganic materials 0.000 claims description 5
• 239000010949 copper Substances 0.000 claims description 5
• 239000010410 layer Substances 0.000 claims description 5
• 238000007747 plating Methods 0.000 claims description 5
• 239000002344 surface layer Substances 0.000 claims description 5
• 230000037431 insertion Effects 0.000 claims description 3
• 238000003780 insertion Methods 0.000 claims description 3
• 230000000149 penetrating effect Effects 0.000 claims 1

Cited By (1)