JPS6294620U - - Google Patents
Info
- Publication number
- JPS6294620U JPS6294620U JP18708385U JP18708385U JPS6294620U JP S6294620 U JPS6294620 U JP S6294620U JP 18708385 U JP18708385 U JP 18708385U JP 18708385 U JP18708385 U JP 18708385U JP S6294620 U JPS6294620 U JP S6294620U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- chip
- internal electrodes
- shaped electronic
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims 1
- 239000003989 dielectric material Substances 0.000 claims 1
- 238000007665 sagging Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Description
第１図は本考案に係るチツプ状電子部品の断面
図、第２図ａ〜ｆは本考案に係るチツプ状電子部
品の製造工程を示す図、第３図は従来のチツプ状
電子部品の断面図である。
１……電子部品素体、２……内部電極、５，６
……金属キヤツプ、２１，２２……電極引出部。
Figure 1 is a cross-sectional view of a chip-shaped electronic component according to the present invention, Figures 2 a to f are diagrams showing the manufacturing process of the chip-shaped electronic component according to the present invention, and Figure 3 is a cross-sectional view of a conventional chip-shaped electronic component. It is a diagram. 1...Electronic component element body, 2...Internal electrode, 5, 6
...Metal cap, 21, 22... Electrode extraction part.
Claims (1)
に埋設し、前記電子部品素体の長さ方向における
端部に、前記内部電極と導通する金属キヤツプを
装着させたチツプ状電子部品において、前記電子
部品素体の前記端部における側端面上に、前記内
部電極を延長して形成された電極引出部を有し、
この電極引出部を前記金属キヤツプに導通させた
ことを特徴とするチツプ状電子部品。 (2) 前記電極引出部はタレによつて形成したこ
とを特徴とする実用新案登録請求の範囲第１項に
記載のチツプ状電子部品。 (3) 前記電子部品素体は誘電体磁器の厚み方向
に誘電体と内部電極とを複数交互に積層したもの
でなり、前記内部電極を、その隔一が並列接続と
なる関係で、前記電極引出部によつて前記金属キ
ヤツプのそれぞれに導通接続させたことを特徴と
する実用新案登録請求の範囲第１項または第２項
に記載のチツプ状電子部品。[Claims for Utility Model Registration] (1) Internal electrodes are embedded in layers in the thickness direction of an electronic component element, and metal caps that are electrically connected to the internal electrodes are provided at the longitudinal ends of the electronic component element. The mounted chip-shaped electronic component has an electrode lead-out portion formed by extending the internal electrode on a side end surface of the end portion of the electronic component element body;
A chip-shaped electronic component characterized in that the electrode lead-out portion is electrically connected to the metal cap. (2) The chip-shaped electronic component according to claim 1, wherein the electrode lead-out portion is formed by sagging. (3) The electronic component element is composed of a plurality of dielectric materials and internal electrodes that are alternately laminated in the thickness direction of dielectric ceramic, and the internal electrodes are connected in parallel with each other. The chip-shaped electronic component according to claim 1 or 2, characterized in that the chip-shaped electronic component is electrically connected to each of the metal caps by a drawer portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18708385U JPS6294620U (en) | 1985-12-04 | 1985-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18708385U JPS6294620U (en) | 1985-12-04 | 1985-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6294620U true JPS6294620U (en) | 1987-06-17 |
Family
ID=31137231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18708385U Pending JPS6294620U (en) | 1985-12-04 | 1985-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6294620U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9905364B2 (en) | 2012-12-28 | 2018-02-27 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component |
-
1985
- 1985-12-04 JP JP18708385U patent/JPS6294620U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9905364B2 (en) | 2012-12-28 | 2018-02-27 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component |