JPS6292644U - - Google Patents
Info
- Publication number
- JPS6292644U JPS6292644U JP1985185737U JP18573785U JPS6292644U JP S6292644 U JPS6292644 U JP S6292644U JP 1985185737 U JP1985185737 U JP 1985185737U JP 18573785 U JP18573785 U JP 18573785U JP S6292644 U JPS6292644 U JP S6292644U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- metal electrode
- heat sink
- brazing material
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985185737U JPS6292644U (US20060028730A1-20060209-C00010.png) | 1985-12-02 | 1985-12-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985185737U JPS6292644U (US20060028730A1-20060209-C00010.png) | 1985-12-02 | 1985-12-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6292644U true JPS6292644U (US20060028730A1-20060209-C00010.png) | 1987-06-13 |
Family
ID=31134644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985185737U Pending JPS6292644U (US20060028730A1-20060209-C00010.png) | 1985-12-02 | 1985-12-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6292644U (US20060028730A1-20060209-C00010.png) |
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1985
- 1985-12-02 JP JP1985185737U patent/JPS6292644U/ja active Pending