JPS6291477U - - Google Patents
Info
- Publication number
- JPS6291477U JPS6291477U JP18219685U JP18219685U JPS6291477U JP S6291477 U JPS6291477 U JP S6291477U JP 18219685 U JP18219685 U JP 18219685U JP 18219685 U JP18219685 U JP 18219685U JP S6291477 U JPS6291477 U JP S6291477U
- Authority
- JP
- Japan
- Prior art keywords
- alignment mark
- solder resist
- printed wiring
- circuit pattern
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985182196U JPH0436146Y2 (US07321065-20080122-C00160.png) | 1985-11-28 | 1985-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985182196U JPH0436146Y2 (US07321065-20080122-C00160.png) | 1985-11-28 | 1985-11-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6291477U true JPS6291477U (US07321065-20080122-C00160.png) | 1987-06-11 |
| JPH0436146Y2 JPH0436146Y2 (US07321065-20080122-C00160.png) | 1992-08-26 |
Family
ID=31127767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985182196U Expired JPH0436146Y2 (US07321065-20080122-C00160.png) | 1985-11-28 | 1985-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436146Y2 (US07321065-20080122-C00160.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01184905A (ja) * | 1988-01-20 | 1989-07-24 | Matsushita Electric Ind Co Ltd | 電子部品用セラミック基板 |
| JPH11238966A (ja) * | 1998-02-24 | 1999-08-31 | Sharp Corp | フレックスリジット多層配線板およびその製造方法 |
| JP2014027164A (ja) * | 2012-07-27 | 2014-02-06 | Kyocer Slc Technologies Corp | 配線基板 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52117257U (US07321065-20080122-C00160.png) * | 1976-03-02 | 1977-09-06 |
-
1985
- 1985-11-28 JP JP1985182196U patent/JPH0436146Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52117257U (US07321065-20080122-C00160.png) * | 1976-03-02 | 1977-09-06 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01184905A (ja) * | 1988-01-20 | 1989-07-24 | Matsushita Electric Ind Co Ltd | 電子部品用セラミック基板 |
| JPH11238966A (ja) * | 1998-02-24 | 1999-08-31 | Sharp Corp | フレックスリジット多層配線板およびその製造方法 |
| JP2014027164A (ja) * | 2012-07-27 | 2014-02-06 | Kyocer Slc Technologies Corp | 配線基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0436146Y2 (US07321065-20080122-C00160.png) | 1992-08-26 |
