JPS6289569A - 半田付け加工装置におけるicパツケ−ジ押圧装置 - Google Patents
半田付け加工装置におけるicパツケ−ジ押圧装置Info
- Publication number
- JPS6289569A JPS6289569A JP22880785A JP22880785A JPS6289569A JP S6289569 A JPS6289569 A JP S6289569A JP 22880785 A JP22880785 A JP 22880785A JP 22880785 A JP22880785 A JP 22880785A JP S6289569 A JPS6289569 A JP S6289569A
- Authority
- JP
- Japan
- Prior art keywords
- holder
- package
- heat source
- rod
- air rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003825 pressing Methods 0.000 title claims abstract description 14
- 238000005476 soldering Methods 0.000 title claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims abstract description 20
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 235000008753 Papaver somniferum Nutrition 0.000 description 1
- 240000001090 Papaver somniferum Species 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22880785A JPS6289569A (ja) | 1985-10-16 | 1985-10-16 | 半田付け加工装置におけるicパツケ−ジ押圧装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22880785A JPS6289569A (ja) | 1985-10-16 | 1985-10-16 | 半田付け加工装置におけるicパツケ−ジ押圧装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6289569A true JPS6289569A (ja) | 1987-04-24 |
JPH0586313B2 JPH0586313B2 (enrdf_load_stackoverflow) | 1993-12-10 |
Family
ID=16882160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22880785A Granted JPS6289569A (ja) | 1985-10-16 | 1985-10-16 | 半田付け加工装置におけるicパツケ−ジ押圧装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6289569A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6384768A (ja) * | 1986-09-26 | 1988-04-15 | Pioneer Electronic Corp | 光ビ−ムハンダ付け装置 |
CN103551693A (zh) * | 2013-10-31 | 2014-02-05 | 深圳市卓茂科技有限公司 | 一种智能热风拆焊系统 |
-
1985
- 1985-10-16 JP JP22880785A patent/JPS6289569A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6384768A (ja) * | 1986-09-26 | 1988-04-15 | Pioneer Electronic Corp | 光ビ−ムハンダ付け装置 |
CN103551693A (zh) * | 2013-10-31 | 2014-02-05 | 深圳市卓茂科技有限公司 | 一种智能热风拆焊系统 |
CN103551693B (zh) * | 2013-10-31 | 2015-08-12 | 深圳市卓茂科技有限公司 | 一种智能热风拆焊系统 |
Also Published As
Publication number | Publication date |
---|---|
JPH0586313B2 (enrdf_load_stackoverflow) | 1993-12-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN114901413B (zh) | 激光回流焊装置及激光回流焊方法 | |
US5565119A (en) | Method and apparatus for soldering with a multiple tip and associated optical fiber heating device | |
EP0002884B1 (en) | Apparatus for soldering chips singly to a substrate providing a multiplicity of chip sites | |
GB2217238A (en) | Apparatus for removing and installing an electronic component with respect to a substrate | |
CN107359134B (zh) | 一种利用激光实现bga芯片返修的方法和装置 | |
CN117117059A (zh) | 一种led倒装芯片固晶、激光焊接及点胶的工艺方法 | |
KR102228432B1 (ko) | 레이저 리플로우 장치의 레이저 가압 헤드 모듈 | |
US5741410A (en) | Apparatus for forming spherical electrodes | |
JPH0541351B2 (enrdf_load_stackoverflow) | ||
US4788403A (en) | Apparatus for automatic soldering | |
KR20200119049A (ko) | 레이저 리플로우 장치의 레이저 가압 헤드 모듈 | |
JPS6289569A (ja) | 半田付け加工装置におけるicパツケ−ジ押圧装置 | |
US4879448A (en) | Apparatus for laser welding and annealing | |
US5983477A (en) | Ball grid array rework alignment template | |
JPH0580304B2 (enrdf_load_stackoverflow) | ||
JPH0226799B2 (enrdf_load_stackoverflow) | ||
JPH0230136Y2 (enrdf_load_stackoverflow) | ||
JPH0239649Y2 (enrdf_load_stackoverflow) | ||
WO1983004202A1 (en) | Method and device for indicating point of contact | |
JPH0785515B2 (ja) | はんだ付装置 | |
JPH0539826Y2 (enrdf_load_stackoverflow) | ||
KR102745990B1 (ko) | Led 리페어 장치 | |
WO1991018494A1 (de) | Hilfsträger zum übertragen von teilen auf einen träger und verfahren zu dessen anwendung | |
JPH11121531A (ja) | 電子部品の実装方法および実装装置 | |
KR102765995B1 (ko) | Led 리페어 장치 |