JPS6289160U - - Google Patents
Info
- Publication number
- JPS6289160U JPS6289160U JP1985181946U JP18194685U JPS6289160U JP S6289160 U JPS6289160 U JP S6289160U JP 1985181946 U JP1985181946 U JP 1985181946U JP 18194685 U JP18194685 U JP 18194685U JP S6289160 U JPS6289160 U JP S6289160U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- hole
- image sensor
- pin
- state image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985181946U JPS6289160U (enExample) | 1985-11-26 | 1985-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985181946U JPS6289160U (enExample) | 1985-11-26 | 1985-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6289160U true JPS6289160U (enExample) | 1987-06-08 |
Family
ID=31127289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985181946U Pending JPS6289160U (enExample) | 1985-11-26 | 1985-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6289160U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7448861B2 (en) | 2003-06-26 | 2008-11-11 | Nec Electronics Corporation | Resin molded semiconductor device and mold |
-
1985
- 1985-11-26 JP JP1985181946U patent/JPS6289160U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7448861B2 (en) | 2003-06-26 | 2008-11-11 | Nec Electronics Corporation | Resin molded semiconductor device and mold |