JPS6289158U - - Google Patents

Info

Publication number
JPS6289158U
JPS6289158U JP18205385U JP18205385U JPS6289158U JP S6289158 U JPS6289158 U JP S6289158U JP 18205385 U JP18205385 U JP 18205385U JP 18205385 U JP18205385 U JP 18205385U JP S6289158 U JPS6289158 U JP S6289158U
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
bonding pad
aluminum wiring
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18205385U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18205385U priority Critical patent/JPS6289158U/ja
Publication of JPS6289158U publication Critical patent/JPS6289158U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP18205385U 1985-11-25 1985-11-25 Pending JPS6289158U (US07923587-20110412-C00022.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18205385U JPS6289158U (US07923587-20110412-C00022.png) 1985-11-25 1985-11-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18205385U JPS6289158U (US07923587-20110412-C00022.png) 1985-11-25 1985-11-25

Publications (1)

Publication Number Publication Date
JPS6289158U true JPS6289158U (US07923587-20110412-C00022.png) 1987-06-08

Family

ID=31127497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18205385U Pending JPS6289158U (US07923587-20110412-C00022.png) 1985-11-25 1985-11-25

Country Status (1)

Country Link
JP (1) JPS6289158U (US07923587-20110412-C00022.png)

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