JPS6289158U - - Google Patents

Info

Publication number

JPS6289158U

JPS6289158U JP18205385U JP18205385U JPS6289158U JP S6289158 U JPS6289158 U JP S6289158U JP 18205385 U JP18205385 U JP 18205385U JP 18205385 U JP18205385 U JP 18205385U JP S6289158 U JPS6289158 U JP S6289158U

Authority

JP

Japan

Prior art keywords

integrated circuit

semiconductor integrated

bonding pad

aluminum wiring

gold

Prior art date

1985-11-25

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 3
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
• 229910052782 aluminium Inorganic materials 0.000 claims description 2
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
• 239000010931 gold Substances 0.000 claims description 2
• 229910052737 gold Inorganic materials 0.000 claims description 2
• 238000002161 passivation Methods 0.000 description 2
• 239000004020 conductor Substances 0.000 description 1