JPS6289141U - - Google Patents
Info
- Publication number
- JPS6289141U JPS6289141U JP18088085U JP18088085U JPS6289141U JP S6289141 U JPS6289141 U JP S6289141U JP 18088085 U JP18088085 U JP 18088085U JP 18088085 U JP18088085 U JP 18088085U JP S6289141 U JPS6289141 U JP S6289141U
- Authority
- JP
- Japan
- Prior art keywords
- land
- semiconductor element
- hook
- corners
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18088085U JPS6289141U (US06277897-20010821-C00009.png) | 1985-11-25 | 1985-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18088085U JPS6289141U (US06277897-20010821-C00009.png) | 1985-11-25 | 1985-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6289141U true JPS6289141U (US06277897-20010821-C00009.png) | 1987-06-08 |
Family
ID=31125239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18088085U Pending JPS6289141U (US06277897-20010821-C00009.png) | 1985-11-25 | 1985-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6289141U (US06277897-20010821-C00009.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01293557A (ja) * | 1988-05-20 | 1989-11-27 | Mitsubishi Electric Corp | 半導体装置 |
| JP2014060211A (ja) * | 2012-09-14 | 2014-04-03 | Omron Corp | 基板構造、半導体チップの実装方法及びソリッドステートリレー |
| JP2014132682A (ja) * | 2014-03-14 | 2014-07-17 | Renesas Electronics Corp | 樹脂封止型半導体装置の製造方法 |
-
1985
- 1985-11-25 JP JP18088085U patent/JPS6289141U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01293557A (ja) * | 1988-05-20 | 1989-11-27 | Mitsubishi Electric Corp | 半導体装置 |
| JP2014060211A (ja) * | 2012-09-14 | 2014-04-03 | Omron Corp | 基板構造、半導体チップの実装方法及びソリッドステートリレー |
| JP2014132682A (ja) * | 2014-03-14 | 2014-07-17 | Renesas Electronics Corp | 樹脂封止型半導体装置の製造方法 |
