JPS6287451U - - Google Patents
Info
- Publication number
- JPS6287451U JPS6287451U JP17905285U JP17905285U JPS6287451U JP S6287451 U JPS6287451 U JP S6287451U JP 17905285 U JP17905285 U JP 17905285U JP 17905285 U JP17905285 U JP 17905285U JP S6287451 U JPS6287451 U JP S6287451U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- power
- wiring board
- printed wiring
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17905285U JPS6287451U (no) | 1985-11-22 | 1985-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17905285U JPS6287451U (no) | 1985-11-22 | 1985-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6287451U true JPS6287451U (no) | 1987-06-04 |
Family
ID=31121760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17905285U Pending JPS6287451U (no) | 1985-11-22 | 1985-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6287451U (no) |
-
1985
- 1985-11-22 JP JP17905285U patent/JPS6287451U/ja active Pending
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