JPS628696U - - Google Patents

Info

Publication number

JPS628696U

JPS628696U JP1985097574U JP9757485U JPS628696U JP S628696 U JPS628696 U JP S628696U JP 1985097574 U JP1985097574 U JP 1985097574U JP 9757485 U JP9757485 U JP 9757485U JP S628696 U JPS628696 U JP S628696U

Authority

JP

Japan

Prior art keywords

land

circuit board

lead wire

hole

heat dissipation

Prior art date

1985-06-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
• 239000002184 metal Substances 0.000 claims description 5
• 230000017525 heat dissipation Effects 0.000 claims 3
• 239000011888 foil Substances 0.000 claims 2
• 230000000149 penetrating effect Effects 0.000 claims 1
• 230000037431 insertion Effects 0.000 description 1
• 238000003780 insertion Methods 0.000 description 1
• 230000005855 radiation Effects 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1