JPS6284963U - - Google Patents
Info
- Publication number
- JPS6284963U JPS6284963U JP17594185U JP17594185U JPS6284963U JP S6284963 U JPS6284963 U JP S6284963U JP 17594185 U JP17594185 U JP 17594185U JP 17594185 U JP17594185 U JP 17594185U JP S6284963 U JPS6284963 U JP S6284963U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- printed circuit
- bonding pattern
- circuit board
- pattern groups
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17594185U JPS6284963U (enExample) | 1985-11-14 | 1985-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17594185U JPS6284963U (enExample) | 1985-11-14 | 1985-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6284963U true JPS6284963U (enExample) | 1987-05-30 |
Family
ID=31115726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17594185U Pending JPS6284963U (enExample) | 1985-11-14 | 1985-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6284963U (enExample) |
-
1985
- 1985-11-14 JP JP17594185U patent/JPS6284963U/ja active Pending
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