JPS6282735U - - Google Patents

Info

Publication number
JPS6282735U
JPS6282735U JP1985173762U JP17376285U JPS6282735U JP S6282735 U JPS6282735 U JP S6282735U JP 1985173762 U JP1985173762 U JP 1985173762U JP 17376285 U JP17376285 U JP 17376285U JP S6282735 U JPS6282735 U JP S6282735U
Authority
JP
Japan
Prior art keywords
tool
shaped chamfer
insertion hole
wire
radius
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985173762U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0219967Y2 (US08197722-20120612-C00042.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985173762U priority Critical patent/JPH0219967Y2/ja
Publication of JPS6282735U publication Critical patent/JPS6282735U/ja
Application granted granted Critical
Publication of JPH0219967Y2 publication Critical patent/JPH0219967Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • H01L2224/78302Shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1985173762U 1985-11-12 1985-11-12 Expired JPH0219967Y2 (US08197722-20120612-C00042.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985173762U JPH0219967Y2 (US08197722-20120612-C00042.png) 1985-11-12 1985-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985173762U JPH0219967Y2 (US08197722-20120612-C00042.png) 1985-11-12 1985-11-12

Publications (2)

Publication Number Publication Date
JPS6282735U true JPS6282735U (US08197722-20120612-C00042.png) 1987-05-27
JPH0219967Y2 JPH0219967Y2 (US08197722-20120612-C00042.png) 1990-05-31

Family

ID=31111525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985173762U Expired JPH0219967Y2 (US08197722-20120612-C00042.png) 1985-11-12 1985-11-12

Country Status (1)

Country Link
JP (1) JPH0219967Y2 (US08197722-20120612-C00042.png)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5313343U (US08197722-20120612-C00042.png) * 1976-07-16 1978-02-03
JPS54160168A (en) * 1978-06-09 1979-12-18 Citizen Watch Co Ltd Pressure bonding capillary chip

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5313343U (US08197722-20120612-C00042.png) * 1976-07-16 1978-02-03
JPS54160168A (en) * 1978-06-09 1979-12-18 Citizen Watch Co Ltd Pressure bonding capillary chip

Also Published As

Publication number Publication date
JPH0219967Y2 (US08197722-20120612-C00042.png) 1990-05-31

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