JPS6281564U - - Google Patents
Info
- Publication number
- JPS6281564U JPS6281564U JP1985172778U JP17277885U JPS6281564U JP S6281564 U JPS6281564 U JP S6281564U JP 1985172778 U JP1985172778 U JP 1985172778U JP 17277885 U JP17277885 U JP 17277885U JP S6281564 U JPS6281564 U JP S6281564U
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- receiving element
- light receiving
- opaque material
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 4
- 239000012780 transparent material Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Sampling And Sample Adjustment (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
第１図は本考案の実施例の研磨装置の模式図、
第２図は実施例の研磨装置の動作説明のための模
式図である。
図において、１は部品、２は透明材（アラルタ
イト）、３は研磨機、４は光照射手段、４―１は
発光素子（ＬＥＤ）、４―２はレンズ、５は受光
素子（ホトトランジスタ）、６は制御部、７は不
透明材を示している。
FIG. 1 is a schematic diagram of a polishing apparatus according to an embodiment of the present invention.
FIG. 2 is a schematic diagram for explaining the operation of the polishing apparatus of the embodiment. In the figure, 1 is a component, 2 is a transparent material (Araltite), 3 is a polishing machine, 4 is a light irradiation means, 4-1 is a light emitting element (LED), 4-2 is a lens, and 5 is a light receiving element (phototransistor) , 6 indicates a control section, and 7 indicates an opaque material.
Claims (1)
位置まで研磨する研磨装置であつて、前記透光材
２の側面Ａに透光材の研磨端面ｂから部品の研磨
位置ａ迄の２倍の長さの不透光材７を設けるとと
もに、前記不透光材の１／２の長さの位置に対向
して設けられ、前記研磨装置の研磨機３と連動す
る光照射手段４と、前記光照射手段４と透光材２
を介して対称位置に設けられた受光素子５と、該
受光素子５の受光結果より前記研磨機３の動作を
制御する制御部６とを備えて成ることを特徴とす
る研磨装置。 This is a polishing device for polishing a component 1 whose outer periphery is fixed with a transparent material 2 to a predetermined position. An opaque material 7 with double the length is provided, and a light irradiation means 4 is provided opposite to the opaque material at a position half the length of the opaque material and operates in conjunction with the polishing machine 3 of the polishing apparatus. , the light irradiation means 4 and the transparent material 2
A polishing apparatus comprising: a light receiving element 5 provided at a symmetrical position with the light receiving element 5 interposed therebetween; and a control section 6 which controls the operation of the polishing machine 3 based on the result of light reception by the light receiving element 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985172778U JPS6281564U (en) | 1985-11-08 | 1985-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985172778U JPS6281564U (en) | 1985-11-08 | 1985-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6281564U true JPS6281564U (en) | 1987-05-25 |
Family
ID=31109623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985172778U Pending JPS6281564U (en) | 1985-11-08 | 1985-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6281564U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01153214A (en) * | 1987-12-10 | 1989-06-15 | Amada Co Ltd | Cutter |
-
1985
- 1985-11-08 JP JP1985172778U patent/JPS6281564U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01153214A (en) * | 1987-12-10 | 1989-06-15 | Amada Co Ltd | Cutter |
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