JPS6280624U - - Google Patents
Info
- Publication number
- JPS6280624U JPS6280624U JP17324385U JP17324385U JPS6280624U JP S6280624 U JPS6280624 U JP S6280624U JP 17324385 U JP17324385 U JP 17324385U JP 17324385 U JP17324385 U JP 17324385U JP S6280624 U JPS6280624 U JP S6280624U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- stamping
- plate material
- resin plate
- cooling pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Description
第１図は、本考案にかかる実施例のスタンピン
グ成形金型の断面図、第２図は、本考案にかかる
実施例のスタンピング成形金型の概略斜視図、第
３図は、従来のスタンピング成形金型で成形した
樹脂シートの断面図、第４図は、本考案にかかる
実施例のスタンピング成形金型で成形した樹脂シ
ートの断面図、第５図は、従来のスタンピング成
形金型の断面図である。
図中、１……ポリプロピレン製樹脂板材、２…
…冷却配管、３……上型、４……下型、５……金
型面、６……スタンピング成形金型、７，１１…
…シート面、８……シボ、９……凹部、１０……
従来のスタンピング成形金型を成形した樹脂板材
。
FIG. 1 is a sectional view of a stamping mold according to an embodiment of the present invention, FIG. 2 is a schematic perspective view of a stamping mold according to an embodiment of the present invention, and FIG. 3 is a conventional stamping mold. FIG. 4 is a cross-sectional view of a resin sheet molded with a stamping mold according to an embodiment of the present invention, and FIG. 5 is a cross-sectional view of a conventional stamping mold. It is. In the figure, 1... polypropylene resin plate material, 2...
...Cooling pipe, 3...Upper mold, 4...Lower mold, 5...Mold surface, 6...Stamping mold, 7, 11...
... Sheet surface, 8 ... Grain, 9 ... Concavity, 10 ...
A resin plate material molded using a conventional stamping mold.
Claims (1)
冷却配管を備えた上型と下型とからなる金型であ
つて、上型と下型の一方または双方の金型面には
シボ加工が施してあり、型閉じした際に樹脂板材
の板厚よりも僅かに小さな型間隔を有することを
特徴とするスタンピング成形金型。 A mold for stamping resin plate material, which consists of an upper mold and a lower mold, each equipped with a cooling pipe, and the mold surface of one or both of the upper mold and the lower mold is textured. A stamping mold, characterized in that when the mold is closed, the mold interval is slightly smaller than the thickness of the resin plate material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17324385U JPS6280624U (en) | 1985-11-11 | 1985-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17324385U JPS6280624U (en) | 1985-11-11 | 1985-11-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6280624U true JPS6280624U (en) | 1987-05-23 |
Family
ID=31110522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17324385U Pending JPS6280624U (en) | 1985-11-11 | 1985-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6280624U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8854593B2 (en) | 1997-05-22 | 2014-10-07 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device |
-
1985
- 1985-11-11 JP JP17324385U patent/JPS6280624U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8854593B2 (en) | 1997-05-22 | 2014-10-07 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device |