JPS6276568U - - Google Patents
Info
- Publication number
- JPS6276568U JPS6276568U JP16878885U JP16878885U JPS6276568U JP S6276568 U JPS6276568 U JP S6276568U JP 16878885 U JP16878885 U JP 16878885U JP 16878885 U JP16878885 U JP 16878885U JP S6276568 U JPS6276568 U JP S6276568U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor elements
- chip
- soldered
- copper foil
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 4
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16878885U JPS6276568U (de) | 1985-11-01 | 1985-11-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16878885U JPS6276568U (de) | 1985-11-01 | 1985-11-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6276568U true JPS6276568U (de) | 1987-05-16 |
Family
ID=31101987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16878885U Pending JPS6276568U (de) | 1985-11-01 | 1985-11-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6276568U (de) |
-
1985
- 1985-11-01 JP JP16878885U patent/JPS6276568U/ja active Pending