JPS6275826U - - Google Patents
Info
- Publication number
- JPS6275826U JPS6275826U JP16893185U JP16893185U JPS6275826U JP S6275826 U JPS6275826 U JP S6275826U JP 16893185 U JP16893185 U JP 16893185U JP 16893185 U JP16893185 U JP 16893185U JP S6275826 U JPS6275826 U JP S6275826U
- Authority
- JP
- Japan
- Prior art keywords
- board body
- board
- synthetic resin
- resin adhesive
- binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 240000008620 Fagopyrum esculentum Species 0.000 claims 1
- 235000009419 Fagopyrum esculentum Nutrition 0.000 claims 1
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
- 239000010903 husk Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
Landscapes
- Drying Of Gases (AREA)
- Building Environments (AREA)
- Air-Conditioning Room Units, And Self-Contained Units In General (AREA)
Description
第１図は本考案の吸湿板の一部拡大して示す使
用状態図、第２図は第１図の―断面図である
。
尚、図中Ａ……吸湿板、ａ……板本体、ｂ……
基台、１……基材、５……エポキシ系合成樹脂接
着剤。
FIG. 1 is an enlarged view of a portion of the moisture absorbing plate of the present invention in use, and FIG. 2 is a cross-sectional view of FIG. 1. In addition, in the figure A... Moisture absorbing plate, a... Board body, b...
Base, 1...Base material, 5...Epoxy synthetic resin adhesive.
Claims (1)
板本体がもみがら、そばがら等の基材にバインダ
ーとして３〜３０ｗｔ％のエポキシ系合成樹脂接
着剤を混合し型成形してなる吸湿板。 The board body is set up on a portable base, and the board body is formed by molding a base material such as rice husk or buckwheat hulls with 3 to 30 wt% epoxy synthetic resin adhesive as a binder. Board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16893185U JPS6275826U (en) | 1985-10-31 | 1985-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16893185U JPS6275826U (en) | 1985-10-31 | 1985-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6275826U true JPS6275826U (en) | 1987-05-15 |
Family
ID=31102272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16893185U Pending JPS6275826U (en) | 1985-10-31 | 1985-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6275826U (en) |
-
1985
- 1985-10-31 JP JP16893185U patent/JPS6275826U/ja active Pending
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