JPS6274979A - Bonding device - Google Patents

Abstract

PURPOSE:To easily cope with the variation in dimensions of the bond area, by forming a means for holding and transferring a plurality of adhesive pieces having a shape corresponding to the bond area of an adherend so that the distance from the center thereof can be enlarged. CONSTITUTION:When a tapered pin 26 is driven downward, each adsorption portion 21 is slid outward against the elastic force of a coiled spring 29 which has been fit into grooves 21g. This serves to enlarge the distance from a central axis A of a vacuum chuck 20 to each of the adsorption ports 22a and 22b (adsorption radius). On the other hand, when the tapered pin 26 is driven upward, each adsorption portion 21 is slid inward through the elastic force of the coiled spring 29, thereby shortening the adsorption radius. The adsorption radius can be adjusted according to the variation in the radius of the bond area of adherends from lot to lot, by regulating the extent of descent of the tapered pin 26 by means of the adjusting screw 28.

Description

[Detailed description of the invention] The present invention will be explained in the following order.

A. Industrial application field B. Summary of the invention C Conventional technology D. Problem that the invention aims to solve E. Means to solve the problem (Figure 1) F. Effect G Example G1-Example and configuration of peripheral devices (Figure 1, Figure 3, Figure 5) Basic operation of G2-embodiment (Fig. 2) Operation of G3-embodiment (Fig. 1) G. Related operations (Figure 4) G1 Effects of the invention A. Industrial application field The present invention relates to a bonding device suitable for automation of bonding.

B. Summary of the Invention The present invention eliminates variations in dimensions of the surface to be adhered by forming a means for holding and transporting a plurality of adhesive pieces having a shape corresponding to the surface to be adhered of an object to be adhered so as to be expandable from the center of itself. This allows for easy adaptation to the following.

C. Prior Art Conventionally, a low retransistor has been used for signal reception between the rotating magnetic head of a magnetic recording apparatus (VTR) and the recording/reproducing amplifier.

As shown in Fig. 6, this low retrance has a plurality of coils (3a) in a plurality of circular grooves (2a) and (2b) concentrically carved on one surface of a ring-shaped core +1+ made of ferrite. , (3b) respectively. And coils (3a), (3b)
A liquid adhesive was used to fix the core (11) in the grooves (2a), (2b).

D Problems to be Solved by the Invention However, due to variations in application conditions, the liquid adhesive may sometimes protrude from the grooves (2a) and (2b), which requires rework such as removing excess adhesive. There is a problem in that it hinders cost reduction and productivity improvement. In addition, since liquid adhesives contain organic solvents,
There was a risk that the vapor would diffuse into the air and contaminate the working environment.

In order to solve the above-mentioned problems, the applicant has proposed an adhesive sheet having double-sided adhesive pieces formed in the shape of split rings corresponding to a plurality of concentric circular grooves ( (Refer to Utility Application No. 1983-109600).

As shown in FIG. 7, the previously proposed adhesive sheet has a tape-like double-sided adhesive layer (5) attached to a base film (4).
) is cut out using a press machine, for example, 4
Divided ring-shaped adhesive piece (5a).

Only (5b) is formed remaining on the base film (4).

By using such adhesive pieces (5a) and (5b), the problems of rework and pollution of the working environment when using liquid adhesive can be solved.

However, it has a split ring shape as shown in Figure 7.

Since the adhesive strips (5a), (5b) are flexible, they are manually picked up from the base film (4) and inserted into the concentric grooves (2a), (2) of the core (1).
2b), it is difficult to insert it flatly into the interior, and a problem arises in that it requires a lot of man-hours.

In addition, the dimensions of the ferrite core (1) vary considerably from loft to loft depending on the various conditions during firing, so in order to accommodate this variation, cutting molds and handling jigs for adhesive pieces of multiple sizes are required. , during the manufacture of low retrans,
Depending on the size of the core to be used, an appropriate mold must be selected to cut out the adhesive piece of the required size, and a handling jig that is compatible with the mold must be selected and used. For this reason,
A problem arises in that the cost burden of molds and the like increases.

In view of the above, an object of the present invention is to provide a bonding device that can easily accommodate variations in dimensions of objects to be bonded having a predetermined shape.

E. Means for Solving the Problems The present invention includes a holding and transferring means for holding and transferring a plurality of adhesive pieces having a shape corresponding to the surface to be adhered of an object to be adhered, and this holding and transferring means is equipped with a holding and transferring means. It is an adhesive device that is formed to be expandable from its center.

F Effect: According to the configuration, it is possible to easily deal with variations in the dimensions of the surface to be bonded. An example that is applicable to a low retrans assembly device will be described.

G1 - Embodiment and Configuration of Peripheral Devices First, with reference to FIG. 3, the configuration of the main parts of an automatic assembly device for a low retransformer including an embodiment of the present invention will be described.

In FIG. 3, (6) is a supply reel, (7) is a take-up reel, and the supply reel (6) has a predetermined shaped adhesive piece (5a> .

A roll (9) is attached, in which an adhesive sheet (5b) arranged at predetermined intervals and a laminating paper (8) are rolled up one on top of the other, and the laminating paper (8) is wound onto the reel (7).

(11) is a peeling table, which is horizontally movable to the left from the illustrated position. The upper surface (12) of the peeling table (11) and one end surface (13) intersect at an acute angle, and the end edge (13e) is polished to an appropriate small radius of curvature by 6Jf. A roller (15) is attached to the LSI 4 at the end of an L-shaped arm (14) extending below the table (11). The clamp (16) is movable together with the table (11), and the clamp (17) is fixed. The base film (4) on which the adhesive pieces (5a) and (5b) are arranged is applied with an appropriate back tension and is peeled off from the supply reel (6) onto the top surface (11) of the rAt table (11).
12), an end face (13) forming an acute angle with this, and a roller (
15), and the leading end of the base film (4) passes through a fixed clamp (17) and is wound onto a reel (18). (19) is a photoelectric position sensor that detects the position of the adhesive pieces (5a) and (5b).

(20) shows the vacuum chuck as a whole that is applicable to the present invention, and when the table (11) is at the limit of movement on the take-up reel (18) side (downstream side), the upper surface of the table (11) (
12) so as to face the downstream side. An adhesive piece (
In order to adsorb the particles 5a) and (5b), suitably shaped suction ports (22a) and (22b) are provided. Note that the adhesive piece and the suction port are illustrated in a simplified manner.

(31) is a core storage part, and the core (1) stored therein is pushed from the upper surface of the supply table (32) into the pressing part (33).
) by the pressing rod (34) of the core table (35).
It is pushed upward and set at a predetermined position and orientation by a positioning jig (36). (37) is an electromagnet, and the connecting member (38) connects the vacuum chuck (20).
The core table (35) is connected to the core (1).
is moved below the electromagnet (37) so as to face it.

(39) is a conveyor, the distance between the conveyor (39) and the core table (35) is set equal to the distance between the core table (35) and the peeling table (11), and the vacuum chuck (20) is When the electromagnet (37) is moved to the lower right and faces the core table (35), the electromagnet (37) is connected to the vacuum chuck (20) by the connecting member (38).
is arranged to face the conveyor (39) above the starting end.

Next, a vacuum chuck (20) which is an embodiment of the present invention will be described with reference to FIG.

In FIG. 1, the suction part (21) is a ring-shaped adhesive piece (5a) divided into four parts, for example, as shown in FIG. 7 above.
, (5b), for example, four suction ports (22a) are provided on the lower surface of each suction portion (21).

(22b) are the air chamber (23) and the exhaust port (22b), respectively.
24) to an external negative pressure source.

(25) is a disc-shaped support member, and two dovetail grooves (25a) each having an inverted trapezoidal cross section are provided in the lower part of the support member so as to be perpendicular to each other. It is movably supported. (26) is a tapered bottle, which is arranged so that its axis coincides with the axis of the support member (25), is driven vertically by an air cylinder (27), and its downward limit is set by a screw (28). be adjusted. Coil spring (29
) is fitted into a groove (21g) surrounding the outer periphery of each suction part (21), thereby elastically fastening each suction part (21). Further, a support member (30) having a slit-shaped cross section is connected to a connecting member (38) via an air cylinder (not shown), and this air cylinder connects the entire vacuum chuck (20) to the connecting member (38).
) is raised and lowered. Further, the vacuum chuck (20) is provided with a plurality of positioning pins (not shown) in order to regulate its relative position with the base film (4).

Corresponding to the above-mentioned assembly apparatus, a suitably colored base film (4) on which adhesive pieces (5a) and (5b) of a predetermined shape are arranged at a predetermined interval is used, as shown in FIG. As shown - a set of adhesive strips (5a).

A plurality of positioning round holes (4a) are provided around the base film (5b), and adhesive pieces (5a) are placed at appropriate positions that are not aligned with the positioning holes (4a) in the longitudinal direction of the base film (4). Square hole (4c) for position detection (5b)
) is provided. In addition, when cutting out the adhesive pieces (5a) and (5b) of the set -, this square hole (4C) is simultaneously opened near the adhesive pieces of the other adjacent set, as shown in the figure. According to the set of adhesive pieces (5a),
(5b) is accurately positioned relative to the vacuum chuck (20).

Further, the adhesive pieces (5a) and (5b) are formed from a heat-sensitive (thermally reactivated) double-sided adhesive film in order to be compatible with the assembly process described below.

Note that the adhesive pieces (5a) and (5b) are manufactured by the present applicant in Utility Application No. 1983-144092 (Utility Model Application No. 58-47).
It can also be arranged on the base film (4) by punching, as disclosed in No. 499).

G2 Basic operation of one embodiment Next, the basic operation of one embodiment of the bonding apparatus according to the present invention will be explained with reference to FIGS. 2A to 2E.

In the initial state, the stripping table (11) is at the limit of movement on the supply reel (6) side (upstream side), and both clamps (1
6) and (17) are in the open state, and the vacuum chuck (20) is in the raised position.

First, as shown in Figure 2A, the upstream clamp (16
) is closed and the base film (4) is placed on the table (11
) is fixed. When the table (11) moves downstream in this state, the downstream clamp (17) is released, so the base film (4) is moved to the take-up reel (18).
It moves downstream together with the table (11) while receiving tension from the table (11).

As shown in Figure B, the edge (13e) of the table (11)
) the pair of adhesive strips closest to (5a), (5b)
is the suction port (22a) of the vacuum chuck (20),
(22b), the position sensor (1
9) is the square hole (4c) of the base film (4) shown in Figure 5 above.
) is detected, and the movement of the table (11) is stopped.

Next, as shown in Figure C, the downstream clamp (17
) is closed, and immediately after that, the upstream clamp (16) is opened and the bank tension torque of the supply reel (6) is temporarily cut off. In this way, the vacuum chuck (
20) are inserted into the adhesive piece (5a) on the base film (4),
(5b) and the suction port (22a) of the vacuum chuck (20).
) and (22b) are exactly opposite to each other.

After that, the vacuum chuck (20) is lowered, and the adhesive pieces (5a), (5b) are attached to the suction ports (22a),
(22b) is adsorbed and held.

From the state shown in FIG. 2C, only the positioning pin (not shown) of the vacuum chuck (20) rises, and the supply reel (6) (
When the back tension torque is supplied again to the device (see Figure 3), the peeling table (11) will move as shown in the figure.
Start moving upstream. At this time, the downstream clamp (
17) is closed, as the table (11) moves, the base film (4) moves along the roller (15) from the edge (13e) of the table (11) to the end surface (13).
) is pulled in the direction of On the other hand, adhesive piece (5a),
('5b) is the suction port (22a) of the vacuum chuck (2C).
) and (22b), so
As shown in the figure, the edge (1) of the peeling table (11) is
At 3e), peeling between the downstream adhesive piece (5b) and the base film (4) begins.

As mentioned above, the suction port (22a) of the vacuum chuck (20)
), (22b) with adhesive piece (5a)
.

Peeling table (11) relatively pressing (5b)
The radius of curvature of the edge (13e) of the table (11) is selected to be appropriately small, and the top surface (12) of the table (11) and the end surface (
13) at an acute angle, so the base film (
When removing step 4), remove the adhesive piece (5b).

The downward force applied to (5a) is small, and the adhesive piece (5b
), (5a) are stably attracted to the vacuum chuck (20).

As shown in FIG. 2E, when the peeling table (11) has moved to its upstream limit, a set of adhesive pieces (5a
), (5b) are separated from the base film (4) and adsorbed to the vacuum chuck (20).

This completes the peeling process and leaves one set of adhesive pieces (5a).

The vacuum chuck (20) that has absorbed (5b) returns to the raised position and the adhesive pieces (5a) and (5b) are picked up from the base film (4). In this state, the vacuum chuck (20) is inserted into the core table (35) in the next insertion process (details will be described later). Placed core (1)
The adhesive piece (5a) moved and transferred to face the
, (5b) as m (2a) of core (1), (
2b) to return to the initial state.

Operation of the G3 Embodiment Returning to FIG. 1 again, the operation of the dimension adjustment mechanism of the vacuum chuck (20) will be described.

In FIG. 1, when the taper pin (26) is driven downward, each suction part (21) slides outward against the elasticity of the coil spring (29) fitted in ;fi (21g). move. Therefore, the distance (suction radius) from the central axis A of the vacuum chuck (2) to each suction port (22a), (22b) is expanded.

Conversely, when the taper pin (26) is driven upwards,
Each suction part (21) slides inward due to the elasticity of the coil spring (29), and the suction radius is shortened.

When the taper pin (26) is at the upper limit of its movement range, the suction radius is minimum, but this minimum suction radius is equal to the lower limit of the variation in the radius of the grooves (2a) and (2b) of the core (1) due to firing. The dimensions of the suction part (21) are set so that Core (grooves for each loft of 11 (2a)
, (2b) is dealt with by regulating the amount of descent of the taper pin (26) by means of adjustment mechanism 28).

Since the vacuum chuck (20) has the above-mentioned suction radius adjustment function, the adhesive piece (5a) that is suctioned by the vacuum chuck (20),
(5b) The radius of curvature of the core (11 grooves (2a
), (2b) are set equal to the lower limit of the radius variation of the grooves (2a), (2b) for each loft of the core (1).
To deal with the variation in the radius of 2b), multiple divisions of ring-shaped adhesive pieces (5a) and (5b) and vacuum chuck (
This is supported by the suction radius adjustment function (20).

``For this reason, despite the variation in the dimensions of the core (1),
It is sufficient to prepare one type of vacuum chuck and one type of adhesive piece cutout mold, which reduces the manufacturing cost of the vacuum chuck and mold, and the man-hours for production preparation such as mold replacement. Coupled with cost reductions due to mitigation, cost reductions and productivity improvements are significant.

G4-related operation Next, referring to FIG. 4, the insertion process involves inserting the adhesive pieces (5a) and (5b) into the grooves (2a) and (2b) of the core (1) using the vacuum chuck (20). I will explain about it. At the start of one cycle of the insertion process, as shown in FIG. 4A, the suction ports (22a) and (22b) of the vacuum chuck (20) touch the adhesive pieces (5a) and 1 on the peeling table (11). (5b), and the electromagnet (37) is connected to the core table (35).
It faces the upper core (IA). The grooves (2a) and (2b) of this core (18) were filled with adhesive pieces (5a) from the previous cycle.

(5b) has been inserted.

In the first step of the insertion process, the vacuum chuck (20)
As described above, adhesive strips (5a), (5b)
adsorbs and picks up. At the same time, the electromagnet (37) attracts the insertion well core (IA) on the core table (35) and moves upward.

In the second step, as shown in Figure B, the vacuum chuck (20) and the electromagnet (37) move together, and the
The stone (37) faces this on the conveyor (39). At this time, the core table (35) is connected to the core supply table (32).
Since a new core (11) is placed adjacent to the core table (see Fig. 3), the vacuum chuck (20) is placed on the core table (3).
5) Do not confront.

In the third step, as shown in Figure C, the core table (35) returns to the predetermined position and the vacuum chuck (20 ) suction ports (22a), (22b
) are inserted into the adhesive pieces (5a) and (5b) and are pressed onto the bottom surfaces of the grooves (2a) and (2b). And the air chamber (23) of the vacuum chuck (20)
Pressurized air is supplied to the adhesive pieces (5a), (
5b) is the suction port (22a).

Move away from (22b). As previously mentioned, glue strips (5
Since heat-sensitive materials are used for a) and (5b), core (1) is! ! It is preheated to a certain temperature.

Meanwhile, the electromagnet (37) is deenergized and the insertion well core (IA
) is placed on a conveyor (39) and transferred to the next coil bonding process.

This completes one cycle of the adhesive piece insertion process, and the vacuum chuck (20) and electromagnet (37) return to the positions shown in FIG. 4A.

Although the embodiment in which the present invention is applied to the assembly of a VTR low retransistor has been described above, the present invention is not limited to this embodiment only, and can be applied to bonding parts having surfaces to be bonded of arbitrary shapes. Can be applied.

Effects of the Invention H As detailed above, according to the present invention, since the means for holding and transporting the adhesive piece is formed to be expandable from the center of itself,
A bonding device that can easily accommodate variations in dimensions of the bonded surfaces of objects to be bonded and is suitable for automation can be obtained.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing the configuration of an embodiment of the bonding device according to the present invention, FIG. 2 is a front view showing the basic operation of the embodiment of the invention, and FIG. FIG. 4 is a route map showing the configuration of peripheral devices; FIG. 4 is a route map showing related operations of an embodiment of the present invention; FIGS. 5, 6, and 7 are plan views and perspective views for explaining the present invention. It is a diagram. (11 is the adherend (core), (2a), (2b)
is the adhesive surface (groove), (5a) and (5b) are the adhesive pieces, (11) is the peeling table, (20) is the holding and transferring means (vacuum chip 1'7), (21) is the suction part, (22a
), (22b) is a suction port, and (26) is a taper pin.

Claims (1)

[Claims] It is provided with a holding and transferring means for holding and transferring a plurality of adhesive pieces having a shape corresponding to the adhered surface of an object to be adhered, and the holding and transferring means is formed to be expandable from the center of the holding and transferring means itself. Adhesive device with special features.