JPS6270500U - - Google Patents
Info
- Publication number
- JPS6270500U JPS6270500U JP16245285U JP16245285U JPS6270500U JP S6270500 U JPS6270500 U JP S6270500U JP 16245285 U JP16245285 U JP 16245285U JP 16245285 U JP16245285 U JP 16245285U JP S6270500 U JPS6270500 U JP S6270500U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- metal layer
- wall covering
- surface layer
- backing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 3
- 239000002344 surface layer Substances 0.000 claims 3
- 238000010276 construction Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は、本考案の第１の実施例の壁装材とそ
の施工例を示す断面図。第２図は、第１の実施例
の壁装材の平面図。第３図は、第２の実施例を示
す断面図。第４図は、第３実施例を示す断面図。
FIG. 1 is a sectional view showing a wall covering material according to a first embodiment of the present invention and an example of its construction. FIG. 2 is a plan view of the wall covering material of the first embodiment. FIG. 3 is a sectional view showing the second embodiment. FIG. 4 is a sectional view showing the third embodiment.
Claims (1)
なり表面層１と裏打層３の端部をずらして、金属
層１の表面層１側または、裏打層３側を露出し、
複数枚の壁装材を施工するときにそれぞれの金属
層の端部２ａ，２ｂが電気的に導通できることを
特徴とする壁装材。 The surface layer 1, the metal layer 2, and the backing layer 3 are laminated in this order, and the ends of the surface layer 1 and the backing layer 3 are shifted to expose the surface layer 1 side or the backing layer 3 side of the metal layer 1,
A wall covering material characterized in that when constructing a plurality of wall covering materials, the ends 2a and 2b of each metal layer can be electrically conductive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16245285U JPS6270500U (en) | 1985-10-22 | 1985-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16245285U JPS6270500U (en) | 1985-10-22 | 1985-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6270500U true JPS6270500U (en) | 1987-05-02 |
Family
ID=31089724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16245285U Pending JPS6270500U (en) | 1985-10-22 | 1985-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6270500U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62229998A (en) * | 1986-03-31 | 1987-10-08 | 清水建設株式会社 | Electromagnetic shielding structure of assembly board |
| JP2000101282A (en) * | 1998-09-18 | 2000-04-07 | Suzuki Sogyo Co Ltd | Connection method for conductive composite sheet and conductive structure body using the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5871103A (en) * | 1981-10-23 | 1983-04-27 | 末松 政行 | Manufacture of natural composite wide thick board and method of executing floor surface of hall of gymnasium, etc. |
| JPS6017995A (en) * | 1983-07-12 | 1985-01-29 | 株式会社八紘 | Composite laminated tape |
-
1985
- 1985-10-22 JP JP16245285U patent/JPS6270500U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5871103A (en) * | 1981-10-23 | 1983-04-27 | 末松 政行 | Manufacture of natural composite wide thick board and method of executing floor surface of hall of gymnasium, etc. |
| JPS6017995A (en) * | 1983-07-12 | 1985-01-29 | 株式会社八紘 | Composite laminated tape |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62229998A (en) * | 1986-03-31 | 1987-10-08 | 清水建設株式会社 | Electromagnetic shielding structure of assembly board |
| JP2000101282A (en) * | 1998-09-18 | 2000-04-07 | Suzuki Sogyo Co Ltd | Connection method for conductive composite sheet and conductive structure body using the same |