JPS626976U - - Google Patents
Info
- Publication number
- JPS626976U JPS626976U JP9800985U JP9800985U JPS626976U JP S626976 U JPS626976 U JP S626976U JP 9800985 U JP9800985 U JP 9800985U JP 9800985 U JP9800985 U JP 9800985U JP S626976 U JPS626976 U JP S626976U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- contacts
- guide tube
- detection device
- sensor electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Description
第１図は本考案の一実施例の構成図、第２図は
はんだ詰まり状態の要部構成図である。 １……はんだ、３ａ，３ｂ……はんだ送りロー
ラ、４……案内チユーブ、６……検出装置、８…
…センサ電極、９……アース電極、１０……アン
プ。
はんだ詰まり状態の要部構成図である。 １……はんだ、３ａ，３ｂ……はんだ送りロー
ラ、４……案内チユーブ、６……検出装置、８…
…センサ電極、９……アース電極、１０……アン
プ。
Claims (1)
- 線状のはんだを一対のはんだ送りローラにより
挾持し、案内チユーブを通じてはんだ付け位置へ
強制的に送給するようにしたものにおいて、上記
案内チユーブの入口側に、はんだ詰まりが生じた
際のはんだの変形によつて該はんだと接触するセ
ンサ電極と、常時はんだと接触するアース電極と
、はんだが上記センサ電極に接触したときに両電
極間を流れる電流を検出してはんだ詰まり信号を
出力するアンプとからなるはんだ詰まり検出装置
を設けたことを特徴とするはんだ送り装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9800985U JPS626976U (ja) | 1985-06-27 | 1985-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9800985U JPS626976U (ja) | 1985-06-27 | 1985-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS626976U true JPS626976U (ja) | 1987-01-16 |
Family
ID=30965542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9800985U Pending JPS626976U (ja) | 1985-06-27 | 1985-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS626976U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012207990A (ja) * | 2011-03-29 | 2012-10-25 | Fujitsu Ltd | ハンダ状態検出装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58202969A (ja) * | 1982-05-21 | 1983-11-26 | Hitachi Ltd | 軟質ワイヤ送給装置 |
-
1985
- 1985-06-27 JP JP9800985U patent/JPS626976U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58202969A (ja) * | 1982-05-21 | 1983-11-26 | Hitachi Ltd | 軟質ワイヤ送給装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012207990A (ja) * | 2011-03-29 | 2012-10-25 | Fujitsu Ltd | ハンダ状態検出装置 |