JPS6268265U - - Google Patents
Info
- Publication number
- JPS6268265U JPS6268265U JP15944485U JP15944485U JPS6268265U JP S6268265 U JPS6268265 U JP S6268265U JP 15944485 U JP15944485 U JP 15944485U JP 15944485 U JP15944485 U JP 15944485U JP S6268265 U JPS6268265 U JP S6268265U
- Authority
- JP
- Japan
- Prior art keywords
- tongue
- multilayer board
- pair
- tongue piece
- slits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15944485U JPS6268265U (it) | 1985-10-18 | 1985-10-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15944485U JPS6268265U (it) | 1985-10-18 | 1985-10-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6268265U true JPS6268265U (it) | 1987-04-28 |
Family
ID=31083882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15944485U Pending JPS6268265U (it) | 1985-10-18 | 1985-10-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6268265U (it) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011523223A (ja) * | 2008-06-13 | 2011-08-04 | エプコス アクチエンゲゼルシャフト | 可撓領域を備えた回路基板およびその製造方法 |
JP2014220458A (ja) * | 2013-05-10 | 2014-11-20 | 株式会社村田製作所 | 樹脂多層基板 |
-
1985
- 1985-10-18 JP JP15944485U patent/JPS6268265U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011523223A (ja) * | 2008-06-13 | 2011-08-04 | エプコス アクチエンゲゼルシャフト | 可撓領域を備えた回路基板およびその製造方法 |
JP2014220458A (ja) * | 2013-05-10 | 2014-11-20 | 株式会社村田製作所 | 樹脂多層基板 |