JPS6263957U - - Google Patents
Info
- Publication number
- JPS6263957U JPS6263957U JP15565085U JP15565085U JPS6263957U JP S6263957 U JPS6263957 U JP S6263957U JP 15565085 U JP15565085 U JP 15565085U JP 15565085 U JP15565085 U JP 15565085U JP S6263957 U JPS6263957 U JP S6263957U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- circuit board
- printed circuit
- foil pattern
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000011889 copper foil Substances 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15565085U JPS6263957U (ko) | 1985-10-14 | 1985-10-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15565085U JPS6263957U (ko) | 1985-10-14 | 1985-10-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6263957U true JPS6263957U (ko) | 1987-04-21 |
Family
ID=31076537
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15565085U Pending JPS6263957U (ko) | 1985-10-14 | 1985-10-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6263957U (ko) |
-
1985
- 1985-10-14 JP JP15565085U patent/JPS6263957U/ja active Pending